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Antenna-In-Package (AiP) Technology refers to the integration of the antenna and RFIC into a package.
In this instance, antennas are directly integrated into the package among other ICs rather than being a separate component located inside the wireless device.
Traditionally, an antenna is mounted separately from the RFIC chipset on a board. A discrete antenna approach is the name given to this method.
The Antenna-In-Package (AiP) Technology solution in a wireless system, where the RFIC and the antenna are combined into a single package.
The Global Antenna-In-Package (AiP) Technology Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
For a variety of millimeter-wave (mmWave) applications, antenna in package (AiP) or Antenna-In-Package (AiP) Technology has become the de facto standard for antenna packaging.
Through our dominance in SiP technology, ASE creates and provides cutting-edge AiP solutions.
ASE offer a full range of Antenna-In-Package (AiP) Technology manufacturing services, including system design, software development, module testing, and electro-thermal modeling, to help their customers create mmWave products that are more compact, more powerful, use less power, and are more affordable.
An antenna or antennas are implemented using Antenna-In-Package (AiP) Technology in an IC package that can hold a bare RF chip (transceiver).
Using System-in-Package (SiP) technologies, the Antenna-In-Package (AiP) Technology can be further integrated with front-end parts, such as power amplifiers (PA) or low-noise amplifiers (LNA), switches, filters, and even a power management integrated circuit (PMIC), to create an antenna module.
The SiP process uses passive component integration, double side molding, selective molding, and a number of EMI shielding approaches.
RF chip (transceiver) attached to package substrate with solder balls for connection to main PCB is a typical component of FCBGA Antenna-In-Package (AiP) Technology.
The topmost portion of the package substrate is covered with an array of antennas that enable wireless communication and detection.
The following are the main advantages of combining an RF chip (transceiver) and an antenna into one package as opposed to including the antenna as a separate component on the system PCB:RF chip and antenna connections that are shorter,reduced signal attenuation and increased signal fidelity,addressing the issues of increased frequency range and propagation,reduced system-level design difficulty,greater freedom in product design,more rapid time to market,Miniature form factor,conceivable for IoT or 5G applications with reduced package sizes.
