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Semiconductor manufacturing equipment is the backbone of the modern electronics industry. It is a complex system of machines and tools used to fabricate semiconductor devices, such as integrated circuits (ICs), transistors, and diodes. These devices are the fundamental building blocks of our digital world, powering everything from smartphones and computers to cars and medical devices. New technologies and processes are being developed to address the challenges faced by the market and enable the production of even more advanced semiconductor devices.
The Asia Pacific region has emerged as a dominant force in the global semiconductor manufacturing industry, driven by significant investments, technological advancements, and a growing demand for electronic devices. This region is home to some of the world’s leading semiconductor manufacturers and equipment suppliers, making it a crucial hub for the global semiconductor industry.
The Asia pacific semiconductor manufacturing equipment market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
To enable improved wafer semiconductor production, Lam Research introduces Coronus DX. It applies a patented protective film layer on both sides of the wafer edge in a single phase, the company claims this helps prevent damage during advanced semiconductor fabrication. Manufacturing sophisticated semiconductors has gotten more difficult due to the necessity for hundreds of processes to create nanometer-sized devices on a silicon wafer.
Coronus DX, developed by American wafer fabrication equipment manufacturer Lam Research, can, in a single step, deposit a proprietary layer of protective film on both sides of the wafer edge, helping to prevent defects and damage that can frequently occur during advanced semiconductor manufacturing. This problem has been solved by this device.It is hailed as the first bevel deposition technology in the market that has been tuned to handle critical manufacturing issues in applications including next-generation logic, 3D NAND, and advanced packaging.
The use of new cutting-edge techniques by chipmakers to produce next-generation chips is made possible by this potent protection, claims Lam Research, which also boosts yield. Production in the era of 3D chip manufacturing is complicated and expensive,Coronus DX helps deliver more predictable manufacture and much greater yield by building on Lam’s expertise in bevel innovation and opening the door for the use of sophisticated logic, packaging, and 3D NAND production techniques that weren’t previously practical.
Increased Automation and Robotics
Advancements in Materials and Processes
Focus on Emerging Technologies
Sustainability and Energy Efficiency
Government Policies and Incentives
Increased Focus on Advanced Packaging Technologies
Growing Demand for Edge Computing and AI
Investments in Emerging Materials
Automation and Robotics
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