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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
In-Circuit Testing (ICT) is one of the most prevalent methods. ICT is a dependable, high-volume, fully automated testing method.
It actually looks at individual parts on the board for any defects. PCBs are intricate devices made up of many parts. There are thousands of connections used to put them together.
An example of white box testing is in-circuit testing (ICT), in which an electrical probe examines a populated printed circuit board (PCB) for shorts, opens, resistance, capacitance, and other fundamental quantities that will demonstrate whether the assembly was correctly constructed.
These three components constitute the primary components of any in-circuit test system. The fixture and software will be tailored to each board or assembly, while the tester will be used with a variety of boards.
Equipment for the circuit test system typically costs a lot of money. An example of white box testing is in-circuit testing (ICT), in which an electrical probe examines a populated printed circuit board (PCB) for shorts, opens, resistance, capacitance, and other fundamental quantities that will demonstrate whether the assembly was correctly constructed.
It can be done with specialized test equipment and a "bed of nails" test fixture, or it can be done with a fixtureless in-circuit test setup.
TheGlobal Automated In-Circuit Test marketaccounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Hikoi is pleased to announce the availability of the FA1220-02 In-Circuit Tester.
The space-saving design system FA1220-02 generates pass/fail judgments for electronic component-packed circuit boards.
In populated board testing and production environments, its slide-in mechanism makes it easier to install and remove test fixtures*.
In-circuit testers with upper and lower test fixtures inspect circuit boards by putting all of the probes on their fixtures in contact with the board being tested.
Because the test locations on different boards are different, the test fixtures need to be changed to fit the kind of circuit board being tested.
As the usefulness and thickness of populated circuit sheets have brown lately, so has the quantity of parts mounted on those sheets, prompting expansions in the quantity of test areas.
The weight of test fixtures goes up because these boards need a lot of probes. As a result of many manufacturers' reliance on multi-model, small-lot production systems, modifying test fixtures to accommodate the type of board being manufactured places a significant strain on workers.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |