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Automated wafer measurer is A Micro-Epsilon profilometer with a high-performance, high-resolution vision system, and laser interferometers make up this sophisticated, adaptable wafer metrology system for comparing laser-cut features on one side of a wafer to those on the other.
At two cassette tilt stations, bowed wafers enter the system. A robot with an edge grip end effector handles the wafers.
Wafers are situated on an indent locater, with wafer ID caught by a Cognex OCR camera. After that, wafers are examined at a bespoke wafer pocket that is positioned on an open-frame X-Y stage assembly.
Opposing vision cameras examine the wafer on the table from top to bottom. Top and bottom fiducials can be used as references for the top and bottom inspections.
The profilometer examines distinctive three-dimensional features with final resolutions of less than 0.1 micron.
Wafers are automatically tracked throughout the system, and the wafer handling and inspection procedures are completely automated. Custom touch-sensitive screens at the user interface allow for visual monitoring of the entire process.
When a wafer is scanned, measurement errors are caused by bowing. The machine uses this information to compensate for the induced errors and achieve the error budget thanks to a specialized self-calibration tool and algorithm that locates extremely minute angular errors in the cameras.
For superior stability, the system is mounted on vibration-isolated granite and supported by a welded steel base.
All pneumatic, PC, and control equipment is held inside the base construction. Weather compensation routines and on-board temperature, humidity, and barometric pressure monitoring make this tool ideal for use in a clean room.
The Global automated wafer measurer market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The automated wafer measurer System was introduced by Hitachi High-Tech. System for In-Line Wafer Surface Inspection to Increase Yield and Reduce Costs of Inspection The LS9600, a new system for detecting particles and defects on non-patterned wafer surfaces, has been introduced by Hitachi High-Tech Corporation.
It includes another high-yield, short-frequency laser that further develops throughput at the awareness levels expected for the large scale manufacturing of state of the art semiconductor gadgets more than the systems of the previous generation.
Hitachi High-Tech will continue to contribute to the improvement of yields and the reduction of inspection costs associated with customers’ mass production of semiconductor devices by introducing this product.
