GLOBAL AUTOMOTIVE CHIP SCALE PACKAGE MARKET

INTRODUCTION

The abbreviation for chip-size packaging was CSP. Only a few packages are chip size, hence the acronym's meaning was modified to reflect chip-scale packaging. According to IPC standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, a package must be single-die, direct surface mountable, and have an area no larger than 1.2 times that of the die in order to be considered chip scale. The ball pitch of these packages must be no greater than 1 mm, which is another requirement frequently used to classify them as CSPs.

The pads may be etched or printed directly onto the silicon wafer, producing a package that is very similar in size to the silicon die: this type of package is known as a wafer-level package (WLP) or a wafer-level chip-scale package. The die may be mounted on an interposer upon which pads or balls are formed, as with flip chip ball grid array (BGA) packaging (WL-CSP).

GLOBAL AUTOMOTIVE CHIP SCALE PACKAGE MARKET SIZE AND FORECAST

The Global automotive chip scale package market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

NEW PRODUCT LAUNCH

For usage in automotive lighting applications, Samsung Electronics, a global leader in innovative component solutions, has unveiled "Fx-CSP," a line-up of LED packages that includes chip-scale packaging and flexible circuit board technology. It offers a cutting-edge pairing of flexible circuit board technology with chip-scale packaging, which combined enable more compact chip scaling and a greater level of dependability. When compared to utilising a ceramic board, employing a flexible circuit board allows for more heat to be dissipated, which results in reduced resistance and higher lumens per watt efficiency.

Infineon Technologies AG unveiled a new ultra-compact plastic packaging technology that, according to the company, takes up only 20% as much room as a typical SC-75 box. Smaller discrete parts in a variety of wireless and portable products are the focus of the Thin Small Leadless Package. The TSLP package significantly reduces the height of the SC-79 package by having a smaller overall footprint than it—1.0 x 0.6 x 0.4 mm3. The new TSLP is appropriate for use with currently available pick-and-place devices and PCB insertion methods.

COMPANY PROFILE

•  NXP Semiconductors
• Infineon Technologies
• Renesas Electronics
• STMicroelectronics
• Texas Instruments Incorporated
• Robert Bosch GmbH
• ON Semiconductor

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. What is the average cost perGlobal automotive chip scale package marketright now and how will it change in the next 5-6 years?
2. Average cost to set up aGlobal automotive chip scale package marketin the US, Europe and China?
3. How manyGlobal automotive chip scale package marketsare manufactured per annum globally? Who are the sub-component suppliers in different regions?
4. What is happening in the overall public, globally?
5. Cost breakup of aGlobal automotive chip scale package marketand key vendor selection criteria
6. Where is theGlobal automotive chip scale package market manufactured? What is the average margin per equipment?
7. Market share ofGlobal automotive chip scale package marketmanufacturers and their upcoming products
8. The most important plannedGlobal automotive chip scale package marketin next 2 years
9. Details on network of majorGlobal automotive chip scale package marketand pricing plans
10. Cost advantage for OEMs who manufactureGlobal automotive chip scale package marketin-house
11. 5 key predictions for next 5 years inGlobal automotive chip scale package market
12. Average B-2-BGlobal automotive chip scale package marketprice in all segments
13. Latest trends inGlobal automotive chip scale package market, by every market segment
14. The market size (both volume and value) ofGlobal automotive chip scale package marketin 2022-2030 and every year in between?
15. Global production breakup ofGlobal automotive chip scale package market, by suppliers and their OEM relationship