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DRAM is a kind of RAM, and it has a number of subtypes. DRAM cannot store data without electricity since it is volatile, like all RAM. DRAM is quick and offers a range of latency and speed choices. For the greatest outcomes, look for a greater speed (MHz) number and a lower latency (CL) value.
Data is stored in DRAM utilising a capacitor’s state of charge, or lack thereof. DRAM may be produced in high densities and at a lower cost than other forms of memory because each DRAM cell only has two parts: a transistor and a capacitor.
Digital electronics frequently employ DRAM when low-cost, high-capacity memory is needed. The main memory (also known as the “RAM”) in contemporary computers and graphics cards (where the “main memory” is referred to as the graphics memory) is one of the most common applications for DRAM.
The Global Automotive DRAM market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry. The 3D X-DRAM from NEO Semiconductor is a first-of-its-kind 3D NAND-like DRAM cell array structure that is based on floating body cell technology without capacitors.
The current 3D NAND-like manufacturing technique may be used to create it, and all that is required is a single mask to designate the bit line holes and create the cell structure inside of them.
The process stages are made easier by this cell shape, which also offers a high-speed, high-density, low-cost, and high-yield solution. Neo predicts that 3D X-DRAM technology would be able to attain 128 Gb density with 230 layers, which is eight times as dense as current DRAM.
To introduce 3D to DRAM, the entire industry is working on it. Contrary to many of the other options for converting DRAM to 3D that have been suggested in academic publications and investigated by the memory industry, adopting 3D X-DRAM entails merely utilising the present mature 3D NAND technique.
Without 3D X-DRAM, the industry will be left with untapped potential, unavoidable production interruptions, and unacceptably high yield and cost issues to deal with.
The next generation of artificial intelligence (AI) applications, including ChatGPT, are driving a rise in demand for high-performance and high-capacity memory chips, necessitating the use of 3D X-DRAM.
