
- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2023-2030
The first type of solid-state storage to be widely used in automobile applications was NAND storage in the form of eMMC. This non-removable memory card is widely used in mobile phones and is glued into a circuit board, making it resistant to continual vibrations.
NAND memory uses electrical circuits to store data and saves information as blocks. A metal-oxide semiconductor will give the memory cell an additional charge when the power is cut off in NAND flash memory, keeping the data there.
NAND is a kind of flash memory that offers faster erase and write speeds than hard drives and needs less chip space per cell, enabling higher storage densities and more affordable prices. As a result of new 3D NAND technology, SSD performance, capacity, and power efficiency are all rising.
The Global Automotive NAND market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Micron Ships Worldâs First 232-Layer NAND, Extends Technology Leadership.New developments provide TLC NAND with the best performance and wafer density, all in the smallest package available in the market.
The first 232-layer NAND in the world has commenced volume production, according to Micron Technology, Inc. It was designed using leading-edge technologies to deliver unheard-of performance for storage solutions.
In comparison to earlier generations of Micron NAND, it offers the most industry-leading areal density, more capacity, and enhanced energy efficiency, enabling best-in-class support for the most data-intensive use cases from client to cloud.
The high-performance storage required to enable cutting-edge solutions and real-time services required in data centre and automotive applications, as well as responsive, immersive experiences on mobile devices, consumer electronics, and PCs, is provided by Micron's 232-layer NAND technology.
In order to meet the low-latency and high-throughput requirements of data-centric workloads such as artificial intelligence and machine learning, unstructured databases and real-time analytics, and cloud computing, this technology node enables the introduction of the fastest NAND I/O speed in the industry, 2.4 gigabytes per second (GB/s).
When compared to Micron's 176-layer node's fastest interface, the speed provides a 50% quicker data transmission.
Additionally, compared to the previous generation, Micron's 232-layer NAND offers up to 100% greater write bandwidth and more than 75% more read bandwidth per die.
Gains in performance and energy efficiency are produced by these per-die advantages in SSDs and integrated NAND technologies.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |