- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2024-2030
High-bandwidth RF connectors' effectiveness and performance are significantly influenced by the reflow connector. The outcomes can occasionally be unanticipated when a high-bandwidth RF connector is soldered along with a well-optimised PCB launch.
It's crucial to look into the underlying factors that contribute to solder reflow variation and to consider the best delivery methods for a wide range of frequencies.
Reflow technology is a method that involves soldering through-hole components to a printed circuit board PCB utilising this technology. Through-hole and surface-mount components can be soldered simultaneously and with the same reflow profile.
The Global automotive reflow connector market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Due to its excellent temperature resistance and melting temperature , ForTii PA4T is a dependable option for applications like automobile reflow connectors.
Due to its high mechanical performance after reflow soldering and high dimensional stability, it is a financially sensible alternative.
ForTii PA4 superior T's mechanical performance reduces reject rates during pin assembly and low isotropic CTE results in high co-planarity and low warpage after soldering. High flowability allows for thinner wall designs.
Two new reflow capable connectors have been released by TE Connectivity (TE), a global leader in connectivity and sensors, for clients who are switching their manufacturing processes to high performance reflow soldering of PCB assemblies.
Both the Economy Power headers and the universal MATE-N-LOK connectors are rectangular wire-to-board power connections constructed utilising a tried-and-true method in which the thermoplastic housings are made to withstand the high temperatures involved in reflow soldering.
Appliances, HVAC equipment, security systems, power supply, industrial machinery, elevators, and escalators are just a few of the many applications for both connectors.
The MX34 Series family of high-density automotive pin connections now includes a new ECU connector, according to Japan Aviation Electronics Industry Co., Ltd.
JAE is a supplier of SMT type and through-hole type components.
The automotive connectors of the MX34 Series, currently on the market, include 64mm cross sectional pin headers.
We have expanded the existing MX34 Series by include a new through-hole reflow type (MX34Q) connector in an effort to offer the industry a response to the anticipated rise in connector deployment.
The through-hole and reflow-compatible SMT type connectors of the MX34 Series are designed for use in high-density, compact automotive electrical system applications. There are also MX34 vertical pin headers for purchase.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
© 2017-2025 Mobility Foresights Pvt Ltd. All rights reserved.