Global Automotive Top Cool MOSFET Devices Market 2023-2030

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    GLOBAL AUTOMOTIVE TOP COOL MOSFET DEVICES MARKET 

     

    INTRODUCTION

     The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET), also known as the metal–oxide–silicon transistor(MOS), is a type of field-effect transistor (FET) that is fabricated by the controlled oxidation of silicon. It has an insulated gate, whose voltage determines the conductivity of the device.

     

    Top Cool MOSFET devices support designers in automotive applications, especially within motor control and DC/DC conversion.

     

    GLOBAL AUTOMOTIVE TOP COOL MOSFET DEVICES MARKET SIZE AND FORECAST

     

    infographic: Automotive Top Cool MOSFET Devices Market, Automotive Top Cool MOSFET Devices Market Size, Automotive Top Cool MOSFET Devices Market Trends, Automotive Top Cool MOSFET Devices Market Forecast, Automotive Top Cool MOSFET Devices Market Risks, Automotive Top Cool MOSFET Devices Market Report, Automotive Top Cool MOSFET Devices Market Share

     

    Global automotive top cool MOSFET devices market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

     

    NEW PRODUCT LAUNCH

    onsemi Launches MOSFETs With Innovative Top-Cool Packaging.Top-side cooling simplifies design and reduces cost for compact power solutions.

     

    onsemi  leader in intelligent power and sensing technologies, today announced a series of new MOSFET devices that feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion.

     

    The company is showing the new devices at its booth 101 in hall C4 at electronica, the world’s leading trade fair and conference for electronics.“Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design”.

     

    Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB).

     

    By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime.

     

    This solution leverages onsemi’s deep expertise in packaging to provide the highest power density solution in the industry. TCPAK57 initial portfolio includes 40V, 60V and 80V.

     

    All devices are capable of operating at junction temperatures (Tj) of 175°C and are AEC-Q101 qualified and PPAP capable.

     

    This, along with their gull wings that allows inspection of solder joints and superior board level reliability, makes them ideally suited to demanding automotive applications. The target applications are high/medium power motor controls such as electric power steering and oil pumps.

     

    COMPANY PROFILE

     

    THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

    1. How many automotive top cool MOSFET devices are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global automotive top cool MOSFET devices and key vendor selection criteria
    3. Where is the automotive top cool MOSFET devices manufactured? What is the average margin per unit?
    4. Market share of Global automotive top cool MOSFET devices market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global automotive top cool MOSFET devices in-house
    6. key predictions for next 5 years in Global automotive top cool MOSFET devices market
    7. Average B-2-B automotive top cool MOSFET devices market price in all segments
    8. Latest trends in automotive top cool MOSFET devices market, by every market segment
    9. The market size (both volume and value) of the automotive top cool MOSFET devices market in 2023-2030 and every year in between?
    10. Production breakup of automotive top cool MOSFET devices market, by suppliers and their OEM relationship

     

    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2023-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2023-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
     
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