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The image sensor, the housing for the image sensor, and the optical train are the three main parts of a wafer-level camera. Wafer-level camera image sensors differ from traditional camera image sensors in one crucial way: pixel size. Pixel size has a significant impact on camera module height.
In order to release a separately packaged die, the wafer is finely sliced. For camera phones, the wafer-level packaging offers two crucial advantages. It goes without saying that the packaging protects against the outside elements (humidity, salt, etc.), and any dirt that does get on the cover glass is removed from the focal plane without affecting the quality of the image.
The 1-megapixel (MP) module of this automotive-grade wafer-level camera, which measures 6.5 x 6.5 mm, gives designers of driver monitoring systems (DMS) the greatest amount of placement freedom inside the cabin while staying unnoticeable.
The Global Automotive wafer-level camera module market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The OVM9284 Camera Cube Chip module from Omni Vision Technologies has been made available. The 1 megapixel, 6.5 x 6.5 mm automotive-grade wafer-level camera gives designers of driver monitoring systems the most positioning options possible inside the cabin while staying unnoticeable.
It is constructed with Omni Pixel 3-GS global-shutter pixels, which offer the highest quantum efficiency in their class at the 940 nm wavelength for the finest possible driver images in almost complete darkness. The integrated OmniVision image sensor offers 1280 x 800 resolution, a 1/4″ optical format, and 3-micron pixels.
Compared to other camera modules on the market, the automobile camera module uses more than 50% less electricity. It can run constantly in the smallest locations and at the lowest temperatures because of its low power consumption capabilities.
