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Back grinding tapes, often called backgrinding tapes or BG tapes, are specialty adhesive tapes used in the semiconductor manufacturing process. Particularly during the process of wafer thinning or backgrinding, they are essential to the manufacture of semiconductor wafers.
After going through a number of production processes, such as etching, deposition, and photolithography, semiconductor wafers must be thinned out using the backgrinding procedure.
The wafers are packaged and assembled into semiconductor devices after being thinned so that their final desirable thickness is reached. The non-active side of the semiconductor wafer’s back is covered by back grinding tapes.
These tapes’ potent adhesive qualities enable them to grip the wafer firmly during the grinding process. The wafer is placed on a grinding machine with the backgrinding tape attached, and material is gently removed from the wafer’s backside using a grinding wheel.
To avoid overheating and wafer damage, this procedure is normally carried out with a coolant.According to the precise specifications of the semiconductor device being produced, the grinding process is carried out until the wafer achieves the necessary thickness.
Back grinding tapes are designed to be easily removably without leaving any residues, bear the mechanical stress of the grinding process, and maintain a strong bond with the wafer surface. To avoid distortion while grinding, they are made to have great temperature resistance.
In order to produce thinner and more sophisticated semiconductor devices, back grinding tapes are an essential component of the semiconductor manufacturing process. They guarantee accurate wafer thinning.
The Global back grinding tapes market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Denka’s ELEGRIP TAPE. During the back grinding process, back grinding tape is used to shield the circuit surface from contamination, chipping, and other external damage.
Low contamination levels, extremely close contact with the wafer, and ease of peeling are functions that the BG tape must do as a result of developments in jumbo-sized, thinner, and high-bumped wafers.
These standards are met with Elegrip BG tape. Additionally, it is water insoluble, which allows for effective use around water and eliminates the need for washing. Outstanding grinding precision (TTV), good water-seepage control during back grinding, simple peeling, and efficient control on adhesive breakdown over time.
