Global Back Grinding Tapes Market 2023-2030

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     Back grinding tapes, often called backgrinding tapes or BG tapes, are specialty adhesive tapes used in the semiconductor manufacturing process. Particularly during the process of wafer thinning or backgrinding, they are essential to the manufacture of semiconductor wafers.


    After going through a number of production processes, such as etching, deposition, and photolithography, semiconductor wafers must be thinned out using the backgrinding procedure.


    The wafers are packaged and assembled into semiconductor devices after being thinned so that their final desirable thickness is reached. The non-active side of the semiconductor wafer’s back is covered by back grinding tapes.


    These tapes’ potent adhesive qualities enable them to grip the wafer firmly during the grinding process. The wafer is placed on a grinding machine with the backgrinding tape attached, and material is gently removed from the wafer’s backside using a grinding wheel.


    To avoid overheating and wafer damage, this procedure is normally carried out with a coolant.According to the precise specifications of the semiconductor device being produced, the grinding process is carried out until the wafer achieves the necessary thickness.


    Back grinding tapes are designed to be easily removably without leaving any residues, bear the mechanical stress of the grinding process, and maintain a strong bond with the wafer surface. To avoid distortion while grinding, they are made to have great temperature resistance.


    In order to produce thinner and more sophisticated semiconductor devices, back grinding tapes are an essential component of the semiconductor manufacturing process. They guarantee accurate wafer thinning.




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    The Global back grinding tapes market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.



    Denka’s ELEGRIP TAPE. During the back grinding process, back grinding tape is used to shield the circuit surface from contamination, chipping, and other external damage.


    Low contamination levels, extremely close contact with the wafer, and ease of peeling are functions that the BG tape must do as a result of developments in jumbo-sized, thinner, and high-bumped wafers.


    These standards are met with Elegrip BG tape. Additionally, it is water insoluble, which allows for effective use around water and eliminates the need for washing. Outstanding grinding precision (TTV), good water-seepage control during back grinding, simple peeling, and efficient control on adhesive breakdown over time.



    1. How many back grinding tapes are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global back grinding tapes and key vendor selection criteria
    3. Where is the back grinding tapes manufactured? What is the average margin per unit?
    4. Market share of Global back grinding tapes market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global back grinding tapes in-house
    6. key predictions for next 5 years in Global back grinding tapes market
    7. Average B-2-B back grinding tapes market price in all segments
    8. Latest trends in back grinding tapes market, by every market segment
    9. The market size (both volume and value) of the back grinding tapes market in 2023-2030 and every year in between?
    10. Production breakup of back grinding tapes market, by suppliers and their OEM relationship


    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2023-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2023-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
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