CERAMIC DUAL-IN-LINE PACKAGING MARKET

INTRODUCTION

A hermetically sealed DIP package, the Ceramic Dual Inline Package, once sealed keeps contaminants and moisture out. An upper element called the cap and a lower part called the base make up the CerDIP package. It uses a metal lid secured to the chip with a metal seal and gold-plated leads brazed to two sides.

The microchip is installed in the base's hollow. An electronic component package having a rectangular enclosure and two parallel rows of electrical connecting pins is known as a ceramic dual in-line package in microelectronics. The package can be put into a socket or through-hole mounted to a printed circuit board.

Originally the use of integrated circuits was constrained by the limited number of leads available on circular transistor-style packages. More signal and power supply links were needed for increasingly complicated circuits.

Higher-density chip carriers were subsequently developed as a result of the need for more leads than a DIP package could accommodate for microprocessors and other complicated devices. Additionally, it was simpler to route printed-circuit traces underneath square and rectangular packages.

The standard term for a DIP is a DIPn, where n is the total number of pins. ceramic DIP packages are used when high dependability, high temperature, or an optical window into the package are required. Pins from DIP packages are typically soldered to PCBs after being inserted via board holes.

A DIP socket is utilised when replacing the parts is required, such as in test rigs or when programmable devices need to be taken out to make adjustments. A zero insertion force mechanism is included in some sockets.

CERAMIC DUAL-IN-LINE PACKAGING MARKET SIZE AND FORECAST

The Global Ceramic dual-in-line packaging Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

CERAMIC DUAL-IN-LINE PACKAGING MARKETNEW PRODUCT LAUNCH

Texas instrument launched cerDip  hermetically sealed DIP package, the Ceramic Dual Inline Package, once sealed keeps contaminants and moisture out. An upper element called the cap and a lower part called the base make up the CerDIP package.

It uses a metal lid secured to the chip with a metal seal and gold-plated leads brazed to two sides. The microchip is installed in a chamber that is present in the base. The cap is placed over the base, and molten seal glass is used to complete the seal.

Once it has cooled and set, the seal glass offers a reliable hermetic seal, which is why military-grade equipment require hermetic packages like the CerDIP. see chip packaging, DIP, and CERQUAD.

The CerDIP package is a more affordable alternative while maintaining the same high performance qualities as the traditional three-layer ceramic package. It is an extremely reliable package that has received military approval. One pressed layer of 92% Alumina makes up the cap and base.

Typically, the base features a hermetically sealed lead frame that is embedded in solder glass. There are numerous lead counts and body sizes for packages. The range of CerDIP lead counts is 8 to 40.

The wide body, which is often slightly less than 600 mils wide, and the thin body, which is typically slightly less than 300 mils wide, are the two common body widths. A cerDIP package normally has a lead pitch of 100 mils.

CERAMIC DUAL-IN-LINE PACKAGING MARKETCOMPANY PROFILES

• Texas instrument
• Analog Devices
•  SACMI
•  Samsung Semiconductor India
• Infineon 
•  Skyworks Solutions

THIS CERAMIC DUAL-IN-LINE PACKAGING MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Ceramic dual-in-line packaging are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Ceramic dual-in-line packaging and key vendor selection criteria
3. Where is the Ceramic dual-in-line packaging manufactured? What is the average margin per unit?
4. Market share of Global Ceramic dual-in-line packaging market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Ceramic dual-in-line packaging in-house
6. key predictions for next 5 years in Global Ceramic dual-in-line packaging market
7. Average B-2-B Ceramic dual-in-line packaging market price in all segments
8. Latest trends in Ceramic dual-in-line packaging market, by every market segment
9. The market size (both volume and value) of the Ceramic dual-in-line packaging market in 2024-2030 and every year in between?
10. Production breakup of Ceramic dual-in-line packaging market, by suppliers and their OEM relationship