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Hand-soldering or industry reflow equipment/processes are no problem for ceramic/hermetic flatpacks.
These sturdy, moisture-resistant packages face substantially higher temperatures throughout standard assembly operation than they do during subsequent conventional Sn/Pb or Pb-free board soldering.
A flatpack is a printed-circuit-board surface-mount component packaging that is standardised by the military. Flat package is defined by MIL-STD-1835C, a military standard (FP).
a square or rectangle package having leads attached to its perimeter on the two opposite sides, parallel to the base plane.
The standard also specifies many varieties with various features, including the body material of the package, the terminal’s placement, the package’s outline, the lead form, and the terminal count.
MIL-PRF-38534 has served as the primary testing platform for high reliability flatpack packaging (General Specification for Hybrid Microcircuits).
The broad specifications for fully completed devices, whether they use single-chip, multi-chip, or hybrid technology,
The Global Ceramic Flatpack market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
As well as offering chip assembly and testing services, StratEdge designs and produces high performance semiconductor packages.
High frequency and extremely high power Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices are their area of expertise in terms of packaging.
For the high requirements of GaN devices, StratEdge has designed a range of packages. Additionally, they offer a full range of post-fired and moulded ceramic semiconductor flatpack that operate between DC to 50+ GHz.
StratEdge packages have extraordinarily low electrical losses, even at frequencies over 50 GHz, thanks to their proprietary electrical transition designs.
Telecom, mixed signal, VSAT, broadband wireless, satellite, military, test & measurement, automotive, and MEMS are some of the markets addressed. StratEdge is a site certified to ISO 9001:2008.
