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Passive heat exchangers that dissipate heat away from the device to maintain a consistent working temperature by transferring it from an electronic component to a fluid medium, frequently air or a liquid coolant. A component called a heat sink promotes heat transfer away from a hot gadget. By enlarging the device’s working surface area and the volume of low-temperature fluid that flows through it, it achieves this goal.
The heat-sink is made of ceramic, which guarantees exceptional thermal conductivity and electrical insulation. The cooler it is when employed in relation to a heat source, the more cooling advantage it provides.
The Global Ceramic heat sink market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Integrated SiC power module on ceramic heat sink launched. An innovative ceramic power semiconductor module for drive inverters in e-mobility was introduced by CeramTec. The test results, which highlight the value of ceramic materials for cutting-edge drive concepts, are being presented by the globally active high-performance ceramics expert.
When it comes to consistently managing the electrical power in e-drives on an ongoing basis and over longer periods of time in the least amount of space, cooling the power electronics in powertrains is essential. CeramTec has created a cutting-edge cooling method for power electronics in e-mobility in collaboration with the Fraunhofer Institute for Integrated Systems and Device Technology (IISB) in Erlangen.
CeramTec uses ceramic heat sinks with metallization on both sides for effective heat dissipation and subsequently better thermal management, making it possible to put semiconductor chips directly to the ceramic cooler (chip-on-heatsink). Both sides can serve as circuit carriers while also being cooled thanks to this design.
The interior cooling structure can be customised to meet each customer’s needs and can be built, for instance, as a pin-fin structure. When heat sinks with CeramTecs chip-on-heatsink technology are directly compared to conventionally built cooling systems in terms of performance, the latter’s thermal resistance is only half as high.
The new SiC power module with an integrated ceramic cooler also uses the chip-on-heatsink concept. The cooler is made up of an improved pin-fin structure and a liquid-flow aluminium nitride cooler with copper metallization on both sides. The extremely small heat sink measures only 48x36mm, is 3.6mm thick (metallization included), and weighs ten grams.
