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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A variety of ceramic packaging known as Ceramic Quad Flat Packages is created using the dry pressing technique. Two dry-pressed ceramic pieces with square or rectangular shapes are silk-screened with solder glass, and the design is then sealed with glaze.
The glass is then heated, creating a mechanical attachment by embedding a lead frame into the base's softened glass. A cap is placed on top of the assembly, heated to the glass melting point, and then allowed to cool once the semiconductor device has been attached and the wires have been bonded.
In this way, the leadframe is fastened to the package's two ceramic layers. Glass is used to attach the leadframe. A variation of the CERDIP package is this one. The "low cost" substitute for CQFP packages is the CERQUAD package, which is mostly utilised for terrestrial applications.
The two leading ceramic package manufacturers, Kyocera and NTK, provide the entire pincount range. In this way, the leads are soldered to the package's top. The package, which is available as HTCC, has multiple layers. One, two, or three bonding decks are possible.
Except for the areas where the leads are connected and the decoupling capacitors are soldered on top of the package, the package is completed with a nickel coating over a thick gold layer. These boxes have hermetic seals. Either seam welding or a eutectic gold-tin alloy is employed to create the hermetic seal.
The internal of the package experiences a substantially lower temperature rise as a result of seam welding. The primary package utilised for space programmes is this one. Parasites are crucial for CQFP packages because of their big bodies.
The decoupling capacitors installed on top of this package improve power supply decoupling. Decoupling capacitors can be put on top of TI's 256-pin CQFP packages, for instance. For instance, decoupling capacitors can be soldered on top of Test-Expert 256-pin CQFP packages.
The Global Ceramic quad flat packaging Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Zilog, a startup business, introduced the Z80, an 8-bit microprocessor. The business constructed its own chip factory using the Z80's sales income.
A software-compatible expansion and improvement of the Intel 8080, the Zilog Z80 was primarily designed for embedded devices. The Z80 became one of the most popular CPUs in desktop and home computers despite being used in that capacity.
In addition, it was frequently used in coin-operated arcade games, musical instruments like synthesisers, and military applications.
Zilog has recently refocused on the rapidly expanding market for embedded systems, and the most recent Z80-compatible microcontroller familyâthe fully pipelined 24-bit eZ80 with a linear 16 MB address rangeâhas been successfully introduced alongside the Z80 and Z180 products, which are more straightforward.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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