CHIP ENCAPSULATION SILICONE RUBBER MARKET 

INTRODUCTION

 Encapsulation of an IC chip bonded on a TAB tape is performed to protect the IC chip from physical and chemical damages in the subsequent processing as well as from the environment during field services. An encapsulant, which is usually a mixture of a polymer resin and a filler material, is applied onto an IC chip by a syringe-type liquid dispensing system before the OLB process.

Several encapsulation schemes are used such as face-coating, full encapsulation (or potting), and transfer molding. The face-coating covers only the top of a chip and the ILB areas, while the potting or full encapsulation covers the top as well as the sides of the chip.

CHIP ENCAPSULATION SILICONE RUBBER MARKET SIZE AND FORECAST

Global chip encapsulation silicon rubber market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

CHIP ENCAPSULATION SILICON RUBBER MARKET NEW PRODUCT LAUNCH

Wacker Presents New Silicone Rubber Grades for Encapsulating LEDs. Wacker, the Munich-based chemical company, will unveil two new encapsulation compounds for light-emitting diodes (LED) at the 20th International Trade Fair for Plastics and Rubber K  Düsseldorf, Germany.

The encapsulants Lamisil 740 and Lumisil770 cure to form highly transparent silicone elastomers. Both silicones withstand exceptionally high operating temperatures and strong light radiation without yellowing or becoming brittle. They are thus ideal for encapsulating high-performance LEDs.

Due to their stability, the new silicones are particularly suitable for encapsulating LED chips with strong heat generation and intense light emission. The two grades differ mainly in the hardness of the cured products. Lamisil 740 cures to form a material with a Shore A hardness of 50, while Lamisil 770 is formulated to be slightly harder at Shore A 70.

Its property profile makes Lumisil740 ideal for the encapsulation of multi-chip LEDs that are applied using the chip-on-board technology – mounted directly onto the printed circuit board, tightly packed, without casing. Lamisil 770, on the other hand, is the material of choice for encapsulating single-chip LEDs.

CHIP ENCAPSULATION SILICON RUBBER MARKET COMPANY PROFILE

• Wacker
• Power
• Shinetsu
• Hellerman
• SIMTEC

THIS CHIP ENCAPSULATION SILICON RUBBER MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How manychip encapsulation silicon rubber are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Globalchip encapsulation silicon rubber and key vendor selection criteria
3. Where is thechip encapsulation silicon rubber manufactured? What is the average margin per unit?
4. Market share of Globalchip encapsulation silicon rubber market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Globalchip encapsulation silicon rubber in-house
6. key predictions for next 5 years in Globalchip encapsulation silicon rubber market
7. Average B-2-Bchip encapsulation silicon rubber market price in all segments
8. Latest trends inchip encapsulation silicon rubber market, by every market segment
9. The market size (both volume and value) of thechip encapsulation silicon rubber market in 2024-2030 and every year in between?
10. Production breakup ofchip encapsulation silicon rubber market, by suppliers and their OEM relationship