CHIP-ON-FILM MARKET

INTRODUCTION TOCHIP-ON-FILM MARKET

In the Chip-On-Film (COF) IC packaging method, a packed chip is transported on a flexible printed circuit film. By using a thermal compression bonding process, the gold bumps on the chip are joined to the inner lead of the flexible substrate circuit. The display sector is the primary user of COF-packed chips.

Because the TAB substrate doesn't have an adhesive layer, Chip-On-Film (COF) technology has better flexibility, more density packaging, fine-pitch capability, and improved durability in high temperatures. These benefits have led to substantial research into COF technology and numerous firms' attempts to create new COF products.

Chip-On-Film (COF) is an IC packaging technology that uses a flexible printed circuit film as a carrier for a packaged chip. The gold bumps on the chip are bonded to the Inner Lead of the flexible substrate circuit by thermal compression bonding technique.

CHIP-ON-FILM MARKET SIZE AND FORECAST

 The Global Chip-On-Film market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

CHIP-ON-FILM MARKETNEW PRODUCT LAUNCH

S6CT92T is an advanced display IC for true-to-life viewing experiences. It is built to deliver stunning picture quality with enhanced efficiency and durability. Samsung’spanel display driver IC (DDI) and timing controller (TCON) open new possibilities for TVs, laptops, and tablets

When using mounting techniques that include making direct electrical connections between IC chips and mounting boards, NAMICS's Chip-on-Film Underfill is employed for flexible substrates as an insulating layer. It can fill small spaces and has exceptional moisture resistance.

Panacol COF is a conductive adhesive for chip-on-film (COF) bonding. It is used for the assembly of flexible circuits and flat panel displays. Panacol-Elosol GmbH is a leading international manufacturer of industrial adhesives as well as medical grade adhesives.

They provide an extensive product range that includes UV adhesives, structural adhesives and conductive adhesives for a wide variety of applications and industries

CHIP-ON-FILM MARKETCOMPETITOR ANALYSIS

Won Chemical Co., LTD produces epoxy and UV curing adhesives, coating materials which are widely used in the electrical and electronic industry. They have done their best to respond technical change in electrical and electronic industry which is changing in high performance rapidly

Panacol-Elosol GmbH was founded in Frankfurt am Main as a German subsidiary of Panacol AG in Switzerland. Since January 2008, Panacol has been a member of the Hönle Group.

Together with Dr. Hönle AG – the parent company of the Hönle Group and a global leader in industrial UV technology – Panacol is a reliable systems provider for bonding technology complete with suitable curing systems

CHIP-ON-FILM MARKETCOMPANY PROFILE

• Samsung
• NAMICS
• Henkel
• Won Chemical
• LORD Corporation
• Hanstars
• Fuji Chemical
• Panacol
• Namics Corporation
• Shenzhen Dover

THISCHIP-ON-FILM MARKETREPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Chip-On-Film are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Chip-On-Film and key vendor selection criteria
3. Where is the Chip-On-Film manufactured? What is the average margin per unit?
4. Market share of Global Chip-On-Film market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Chip-On-Film in-house
6. key predictions for next 5 years in Global Chip-On-Film market
7. Average B-2-B Chip-On-Film market price in all segments
8. Latest trends in Chip-On-Film market, by every market segment
9. The market size (both volume and value) of the Chip-On-Film market in 2024-2030 and every year in between?
10. Production breakup of Chip-On-Film market, by suppliers and their OEM relationship