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Last Updated: Apr 25, 2025 | Study Period:
The materials used in a circuit board are chosen for their specific properties. The insulating base material must be strong and durable, and it must also be able to withstand the heat generated by the electrical components.
Common materials used for the base material include FR4 (a fiberglass-reinforced epoxy), phenolic, and paper-based materials. The conductive material must be a good conductor of electricity, and it must also be able to withstand the heat and wear and tear of the circuit board.
Common materials used for the conductive material include copper, tin, and silver. Solder is a metal alloy that is used to join the electrical components to the conductive material. It must be a good conductor of electricity, and it must also be able to flow easily and create a strong bond.
Solder is typically made from tin and lead, but lead-free solder is becoming increasingly common. The mask is a material that is used to protect the conductive material from solder. It is usually made of a material that is not conductive, such as a plastic or a ceramic.
The mask is applied to the circuit board before the solder is applied, and it helps to prevent the solder from flowing to unwanted areas. Varnish is a material that is used to protect the circuit board from moisture and other environmental factors.
It is usually made of a material that is resistant to water and chemicals. Varnish is applied to the circuit board after the solder has been applied, and it helps to protect the circuit board from corrosion and other damage.
The specific materials used in a circuit board will vary depending on the type of circuit board and the environment in which it will be used. For example, a circuit board that will be used in a harsh environment, such as a military application, will need to be made of materials that are resistant to extreme temperatures, chemicals, and other environmental factors.
The Global Circuit Board Materials Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Panasonic Corporation today announced that its Industry Company has developed MEGTRON 8 Multi-Layer Circuit Board Materials with Low Transmission Loss, which are intended for high-speed communication networking equipment such as routers and switches.
The global deployment of the fifth-generation mobile communication system (5G) is accelerating the trend of continuous societal transformation towards the Internet of Everything (IoE), in which everything will be connected via the Internet.
As IoE technology advances, the number of linked terminals and the amount of communication data are predicted to skyrocket. Solutions for high-speed signal processing and higher power consumption have become key technological difficulties as a result of this development.
The backbone of IoE technology, high-speed communication networking equipment, will now need to fulfill 800 GbE.which are twice as fast as the existing 400 GbE standards.
The transmission loss rises according to the speed and frequency of the electricity flowing through the wires in printed circuit boards. To assure signal quality, innovative, high-performance circuit board materials with low transmission loss are necessary.
Panasonic's own resin design skills and material compounding processes enable it to provide both the exceptional dielectric characteristics and low transmission loss necessary for high-performance, high-layer-count circuit boards. MEGTRON 8 also has ultra-low dielectric dissipation factor glass cloth and low-profile copper foil[6] from Panasonic.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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