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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A board substrate (core) is a dielectric substance most frequently made of glass fiber weave (sometimes unwoven) and epoxy resin. Ceramics can be added to these materials to raise the dielectric constant.
The conducting layer in PCBs is often made of metals like copper, aluminum, and iron. The most popular metal is copper. Due to this, the majority of PCBs are "copper clad." Surface mount technology, or SMT, components can be used with any metal used for PCB construction.
The term "substrate-like-PCB" (SLP) refers to the transformation of a PCB board into a product with attributes like those of a package substrate. Thin conductors/interconnectors are used in substrate-like PCBs to effectively transport signal and power to all connected components while lowering power consumption.
The Global circuit board substrate material market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
EMC Launches 112Gb/s Design and New IC Substrate Materials at DesignCon. Increased transmission speed and bandwidth are required for applications in upcoming cloud technologies, 5G, IOTs, edge computing, AI, and data centers.
Due to these demands, EMC created cutting-edge technologies, including 224 Gb/s Serdes Speed for 800G and 1.6TB Ethernet applications in the future.
Extremely low loss materials EM-892K and EM-892K2 will be highlighted by EMC (where "K" stands for low Dk/Df glass and "K2" for next-generation low Dk/Df glass). These resources have consistently outperformed others in their field.
In order to achieve Dk 2.9 / Df 0.0017 for EM-892K and Dk 2.8 / Df 0.0013@10GHz for EM-892K2, these materials have been developed using EMC's cutting-edge Halogen-Free technology. Both EM-892K models can resist at least 7 lamination cycles.
To meet upcoming 800G design problems, several Tier-1 OEMs, ODMs, and PCB fabricators have already certified the EM-892K and EM-892K2 materials with HVLP3 or HVLP4 foil.
EMC has launched the 2nd generation IC Substrate materials "EM-S530/ S530K" suited for antenna-in-package (AIP) and "EM-S570" perfect for FCBGA/ FCCSP applications, which penetrate both ELIC designs and substrate-like CTE applications.
In addition to these materials, Arlon EMD, a local US firm that EMC just bought, is debuting a new polyimide product called 86HP. A special polyimide resin with outstanding anti-CAF performance is used in the 86HP.
Designs with densely packed thru-hole topologies, HDI, high layer counts, and high temperature applications are appropriate for using Arlon's 86HP.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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