Global Cloud Electronic Design Automation Market 2023-2030
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Global Cloud Electronic Design Automation Market 2023-2030

Last Updated:  Apr 25, 2025 | Study Period: 2023-2030

GLOBAL CLOUD ELECTRONIC DESIGN AUTOMATION MARKET

 

INTRODUCTION

 Software tools for creating electronic systems like integrated circuits and printed circuit boards are referred to as "electronic design automation" . To create and analyze complete semiconductor devices, chip designers employ a set of interconnected tools known as a design flow. Cloud EDA represents a chance.

Infographics-Cloud Electronic Design Automation Market , Cloud Electronic Design Automation Market Size, Cloud Electronic Design Automation Market Trends, Cloud Electronic Design Automation Market Forecast, Cloud Electronic Design Automation Market Risks, Cloud Electronic Design Automation Market Report, Cloud Electronic Design Automation Market Share

 

Design tape outs may also be delayed by internal competition for scarce company resources. Companies may shorten their time to market and accelerate innovation with cloud EDA while preserving or reducing operating costs.

 

Chip designers are increasingly relying on cloud-based electronic design automation (EDA) technologies as they look for new ways to obtain better performance, more functionality, and the lowest power consumption out of their advanced node designs (within constrained timetables and budgets, no less).

 

GLOBAL CLOUD ELECTRONIC DESIGN AUTOMATION MARKET   SIZE AND FORECAST

 

The global cloud electronic design automation market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

 

RECENT PARTNERSHIPS

To enable its customers to implement EDA tools on public cloud services, Synopsys has worked with leading cloud service providers, including Alphabet's Google, Amazon Web Services (AWS), and Microsoft Azure.

 

Additionally, it has collaborated closely with top contract chip foundries like GlobalFoundries, Samsung, and TSMC to ensure that its cloud-based products are compatible with their process design kits and libraries (PDKs).

 

However, clients may immediately access and pay for computational resources from Azure and preconfigured cloud-based chip design tools from Synopsys thanks to the company's new "software as a service" offering.

 

Customers can use Synopsys Cloud in a "bring your own cloud" fashion if they already lease computer resources from Amazon, Google, Microsoft, or other public cloud-computing providers.

 

Instead of making long-term investments in data center renovations, this allows its customers the flexibility to scale computing capabilities up or down in response to changing chip design and verification needs.

 

This enables them to accomplish activities like speeding up verification procedures or conserving runtime when simulating a new semiconductor design's performance. 

 

Cadence Design Systems, a leading EDA company, announced a strategic partnership with TSMC, the world's largest semiconductor foundry. The collaboration aimed to advance the development of advanced node technologies, specifically focusing on 3nm and beyond.

 

This partnership allowed Cadence to optimize its EDA tools for TSMC's cutting-edge process technologies, enabling chip designers to take full advantage of TSMC's latest nodes and improve their time-to-market for innovative semiconductor products.

 

In return, TSMC benefited from enhanced design capabilities and better support for their manufacturing processes, ultimately bolstering their position as a leading foundry.

 

Siemens Digital Industries Software, a prominent player in the EDA space, joined forces with Arm, a leading semiconductor IP provider, to accelerate the design and validation of Arm-based chips for various applications, including Internet of Things (IoT) devices and automotive electronics.

 

The partnership aimed to streamline the integration of Arm's processor cores into Siemens' EDA tools, allowing chip designers to efficiently develop complex systems-on-chip (SoCs) while ensuring robustness and power efficiency.

 

This collaboration also enabled Siemens and Arm to address the growing demands of emerging markets and cater to the increasing need for highly efficient, low-power electronic devices.

 

In an effort to advance the development of advanced semiconductor technologies, Synopsys, a leading EDA solutions provider, collaborated with Samsung Electronics, one of the largest semiconductor manufacturers globally.

 

The partnership focused on co-optimizing Synopsys' EDA tools for Samsung's advanced process nodes, including 5nm and below.

 

By collaborating closely, both companies aimed to accelerate the design and verification of complex chips and systems, while also ensuring adherence to stringent quality and reliability standards.

 

This partnership played a pivotal role in enabling Samsung to deliver cutting-edge semiconductor products to a diverse range of industries, including mobile, automotive, and artificial intelligence.

 

Mentor, a Siemens Business, teamed up with Intel, a leading semiconductor company, to drive the development of automotive-focused solutions.

 

The partnership aimed to address the challenges associated with designing advanced driver-assistance systems (ADAS) and autonomous driving technologies.

 

By integrating Mentor's EDA tools with Intel's automotive-grade computing platforms, the companies sought to provide a comprehensive solution that would enable automotive chip designers to develop safer and more reliable electronic systems.

 

This collaboration was crucial in meeting the stringent safety and performance requirements of the automotive industry and driving innovation in the field of autonomous vehicles.

 

 

COMPANY PROFILE

 

 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

  1.  How many Cloud Electronic Design Automation are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global Cloud Electronic Design Automation and key vendor selection criteria
  3. Where is the Cloud Electronic Design Automation manufactured? What is the average margin per unit?
  4. Market share of Global Cloud Electronic Design Automation market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global Cloud Electronic Design Automation in-house
  6. key predictions for next 5 years in Global Cloud Electronic Design Automation market
  7. Average B-2-B Cloud Electronic Design Automation market price in all segments
  8. Latest trends in Cloud Electronic Design Automation market, by every market segment
  9. The market size (both volume and value) of the Cloud Electronic Design Automation market in 2023-2030 and every year in between?
  10. Production breakup of Cloud Electronic Design Automation market, by suppliers and their OEM relationship

 

 

Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
19Market Segmentation, Dynamics and Forecast by Application, 2023-2030
20Market Segmentation, Dynamics and Forecast by End use, 2023-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix