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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Metal ions go from a positive electrode to a negative electrode through a solution during the electroplating process through a CNC electroplating machine. Objects at the cathode are covered with the metal in the solution as a result of an electrical current flowing through it.
The most popular electroplated goods are jewelry, while many products incorporate electroplated components. The bumpers, hubcaps, grilles, door handles, and other aesthetic trims on an automobile are only a few examples of the countless electroplated components.
The car's body and various automotive components are electroplated to guard against rust, heat, and other potential harm.Similar to the automotive sector, the aerospace industry also uses electroplated components, but they do so to enhance the aircraft's body's hardness and thickness and make it more resistant to atmospheric and other environmental factors.
To ensure high plating quality, finished goods in electroplating are put through a number of tests. Typical examples of these tests include: Adhesion: Using a twist, a bake, or tapeVisual and microscopic appearance (to the level of magnification contractually agreed on).
Solderability,Bonding, such as with ultrasonic wire bondingPorosity: Nitric acid immersion, vaporization, and electrolytic or gas methods are all possible.X-ray Fluorescence (XRF) or microsection for thickness
The Global CNC electroplating machine market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Tanaka Holdings Co., Ltd. announced that the CNC electroplating machinefor semiconductor wafers, which produces equivalent films to mass-production machines, has been developed and launched by Electroplating Engineers of Japan, Limited (EEJA), which runs the plating business for Tanaka Precious Metals.
Japanese Association of Electroplating Engineers Semiconductor Wafer up type Ultra-compact Laboratory Equipment for PlatingThe RAD-Plater is a piece of incredibly small laboratory gear used to create semiconductor wafers from 2 to 8 inches.
It is smaller than mass production machines, measuring 800 mm wide and 700 mm deep, and it can only run on compressed air and standard 100 volt power. It can employ a wide range of plating solutions, including alloys and lead-free solutions, in addition to gold, silver, palladium, copper, and nickel.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |