By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
In a single packed assembly, co-Packaged Optics offers optical I/O for Ethernet switches or disaggregated computing and addresses some of the issues brought on by pluggable optics, such as port density, power consumption, thermal management, and bandwidth.
To increase bandwidth and energy efficiency, it is important to shift the electro-optic conversion process as close as feasible to the computation, switch, or ASIC die.
In terms of the necessary electrical and optical densities, thermal concerns, and power consumption, it is anticipated that the current form factors of pluggable optics will be unable to sustain capacities of 1.6 Tb/s, 3.2 Tb/s, and higher.
Future pluggable optics will be constrained by power dissipation and thermal management due to the deployment of discrete electrical devices.
A novel strategy called co-packaged optics (CPO) seeks to address these issues by moving the optics closer to the switch ASIC. The well-known pluggable optics are regarded to be obsolete by CPO technology, which is seen as a new deployment mechanism for the entire ecosystem.
When CPO reaches commercial status, it may take over in some applications, but this does not imply that pluggable optics will disappear entirely.
The Global co-Packaged Optics market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Broadcom and Tencent have joined forces to accelerate the implementation of high-bandwidth co-packaged optic switches. In a significant development, Broadcom is set to deploy its first switch, named Humboldt, equipped with internal optics in the data centers of the renowned cloud provider.
These switches are underpinned by an innovative architecture that has been integrated into traditional switches, introducing co-packaged optical interconnects. This approach, commonly referred to as co-Packaged Optics, involves the relocation of optics and digital signal processors (DSPs) from the pluggable modules typically located at the switch’s front. Instead, they are transformed into chiplets through silicon photonics and subsequently bundled together with the Application-Specific Integrated Circuit (ASIC).
This partnership represents a significant step forward in enhancing the capabilities of data center switches and their efficiency by seamlessly integrating optical and digital components into a single cohesive solution.
Ayar Labs, a leading provider of co-packaged optics solutions, raised $130 million in funding from a group of investors. The funding will be used to accelerate the development and commercialization of Ayar Labs’ co-packaged optics products.
Broadcom Inc.,acquired RainTree Photonics, a leading provider of co-packaged optics products. The acquisition is expected to strengthen Broadcom’s co-packaged optics portfolio and give the company a competitive advantage in the growing co-packaged optics market.
Intel Corporation and Cisco Systems, Inc., two leading technology companies, announced that they are collaborating to develop co-packaged optics for 5G networks. The two companies are working together to develop new co-packaged optics products that can support the high bandwidth and low latency requirements of 5G applications.
Marvell Technology Group announced the launch of its new co-packaged optics technology for cloud data centers. The new technology is designed to improve the performance and efficiency of cloud data center networks.
Considerations for Testing High-Density Co-Packaged Optical Devices. Datacenter, machine learning, and artificial intelligence applications currently require more than 25.6Tb/s of bandwidth. However, attaining the high channel counts required to achieve these speeds using the existing approach of pluggable modules that insert into the faceplate of the rack mount switch is extremely difficult.
To overcome these issues and minimise data transmission bottlenecks, optical engineers are developing co-packaged optical devices, which bring optics and electronics closer together in a single packaged component. However, like with any new technology, engineers must not only work through the complexity of building the actual devices, but they must also have the technology to swiftly test the functionality of these channel-dense systems.
The work being done on the 3.2T Co-Packaged Optical Module Implementation Project to produce devices that will boost bandwidth without significantly increasing energy consumption or transceiver footprint.
CO-PACKAGED OPTICS MARKET SEGMENTATION
Co-Packaged Optics Market By Type
Co-Packaged Optics Market By Application
Co-Packaged Optics Market By Region
Co-Packaged Optics Market By Data Rate