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In a single packed assembly, co-Packaged Optics offers optical I/O for Ethernet switches or disaggregated computing and addresses some of the issues brought on by pluggable optics, such as port density, power consumption, thermal management, and bandwidth.
To increase bandwidth and energy efficiency, it is important to shift the electro-optic conversion process as close as feasible to the computation, switch, or ASIC die.
In terms of the necessary electrical and optical densities, thermal concerns, and power consumption, it is anticipated that the current form factors of pluggable optics will be unable to sustain capacities of 1.6 Tb/s, 3.2 Tb/s, and higher.
Future pluggable optics will be constrained by power dissipation and thermal management due to the deployment of discrete electrical devices.
A novel strategy called co-packaged optics (CPO) seeks to address these issues by moving the optics closer to the switch ASIC. The well-known pluggable optics are regarded to be obsolete by CPO technology, which is seen as a new deployment mechanism for the entire ecosystem.
When CPO reaches commercial status, it may take over in some applications, but this does not imply that pluggable optics will disappear entirely.
The Global co-Packaged Optics market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
To hasten the deployment of high-bandwidth co-packaged optic switches, Broadcom and Tencent have partnered. The business announced that it will install its first switch with internal optics, known as Humboldt, in the data centres of the cloud giant.
The switches are based on a new architecture that was introduced inside a conventional switch and brings co-packaged optical interconnects. The method, also known as co-Packaged Optics, transfers the optics and digital signal processors (DSPs) out of the pluggable modules that are positioned at the front of the switch, converts them into chiplets using silicon photonics, and then packages them with the ASIC.
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