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Laser drilling is a type of drilling where holes are carved into the material using laser light. For all other drilling operations, material is removed from the workpiece using a physical drill cut, which normally revolves. Nevertheless, laser drilling uses the heat energy of laser light to pierce workpieces with holes.
Lasers can be used to drill holes in a wide range of materials, including ceramics, metals, and wood. The cooling holes in aero-engine parts, the holes in fuel injection nozzles, the holes in ink-jet printer heads, and the micro-vias in PCBs are typical examples of laser-drilled holes in real-world applications.
The Global CO2 Laser Drilling Machine market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Next-generation UV Laser Drilling Tool is now available from ESI. The CornerStone ICP Series 1 UV laser drilling system was unveiled by Electro Scientific Industries Inc., a major provider of cutting-edge laser-based manufacturing solutions for the micro-machining sector.
The system is intended for use first in Integrated Circuit Packaging (ICP) applications. This revolutionary platform from ESI offers lower overall Cost of Ownership (CoO), higher precision, and a smaller footprint as compared to conventional laser drill tools, enabling the manufacturing of vias (Vertical Interconnect Access) for current and next-generation products.
For drilling vias smaller than 100 micrometres in diameter, laser techniques are frequently used in organic substrate materials used for ICPs.
The CornerStone ICP Series 1 technology allows packaging producers to address design criteria for even smaller vias and higher accuracy anticipated in the future while meeting the production demands of today.
They are excited about the CoO advantage they can offer their customers and are looking forward to supplying a comprehensive and affordable solution to the via drilling market. With this introduction, they are addressing existing design requirements while providing a significantly lower cost of ownership in an industry-leading small footprint.
