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The term “Computer-On-Module High-Performance Computing” (COM HPC) server module describes a specialized computer element created to deliver high-performance computing capabilities to a modular and compact form factor. With applications ranging from scientific research to data analysis and industrial applications, this innovation responds to the rising demand for strong computing solutions in a variety of industries.
A COM HPC Server Module is essentially a miniature computer system with all of the necessary hardware built into a single board, including the processor, memory, storage, and networking interfaces. In applications where conventional, room-consuming server installations are impracticable, this architecture maximizes space usage and energy efficiency.
A COM HPC Server Module’s modularity serves as its defining quality. Instead of being heavy and rigid like traditional servers, these modules follow standardized form factors, making it possible to swap them out or upgrade them without having to make significant changes to the overall computer infrastructure. This modular strategy improves scalability, decreases downtime, and streamlines maintenance.
Organizations can adjust to changing computing requirements without replacing entire server racks by merely replacing or upgrading a module. The use of cutting-edge processors and high-speed memory, frequently purchased from top technology suppliers, is what gives COM HPC Server Modules their computing strength. These elements make sure the modules are capable of handling intricate computations, data-intensive operations, and simulations with amazing speed and effectiveness
The Global COM HPC Server Module market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The first COM-HPC Server-on-Module powered by AMD EPYC 7003 Embedded processors was unveiled by Advantech. Edge server engineers will notice a noticeable performance increase thanks to the new COM-HPC Size E Server-on-Modules (200 x 160 mm), which offer more than treble the amount of edge server cores compared to any other COM-HPC server module on the market.
The benefit of the Server-on-Modules approach in these applications is that it is quicker and less expensive to construct a dedicated server design.
Because of this, manufacturers of industrial-grade server hardware are able to provide platforms for fully customised solutions even for low-volume projects like those seen in industrial applications.
In order to accelerate time-to-market and design-in security, Advantech offers optimal cooling solutions as well as complete software design-in services for emerging edge computing and AI applications.
Congatec, a top supplier of embedded and edge computing technologies, will exhibit its complete COM-HPC ecosystem. The portfolio now includes everything from ultra-compact, brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card to high-performance COM-HPC Server-on-Modules.
Congatec now offers everything designers require for their upcoming high-end embedded and edge computing platforms, including the specialized cooling solutions, carrier boards, and design-in services.
Even the most space-constrained solutions can now gain from a high-performance boost and a much greater number of new high-speed connectors thanks to the new COM-HPC Mini standard. With no significant changes to the internal system design or housing needed, whole product lines can now transition to the new PICMG standard.
The COM-HPC Ampere Altra is the first 80-core COM-HPC server type module in the world and is offered by ADLINK Technology Inc., a leader in the field of edge computing.
The new server type module aims to eliminate inefficiencies and limitations generally brought on by memory caches and system memory limits on edge devices, and instead targets edge platforms that reliably and predictably perform the most computationally intensive workloads.
The COM-HPC Ampere Altra core is an Ampere Altra SoC (system on a chip) based on the Arm Neoverse N1 architecture, offering premium performance inside a somewhat constrained thermal environment, lower TCO than x86 designs, and much less power usage
