By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
COMs offer several advantages over traditional single-board computers (SBCs), such as reduced development time, modular design, and scalability. These advantages make COMs an attractive choice for developers and system integrators.
The COM market is expected to continue evolving with advancements in technology, increased integration capabilities, and a focus on meeting the specific needs of various industries.
COMs play a role in the automotive industry for applications like infotainment systems and advanced driver-assistance systems (ADAS).COMs are integral to the development of IoT devices and edge computing solutions.
COMs offer customization and flexibility, allowing developers to create tailored solutions for specific applications.A trend towards smaller form factors, addressing the demand for compact and space-efficient solutions.
The COM market is expected to witness continued growth as advancements in semiconductor technology and manufacturing processes enable more powerful and energy-efficient modules. Emerging technologies such as 5G connectivity, artificial intelligence (AI), and edge computing are likely to influence the design and capabilities of future COMs.
Major players in the COM market include companies like ADLINK Technology, Kontron, congatec, and Axiomtek. Semiconductor manufacturers such as Intel and AMD also play a significant role in providing processors for COMs.
A compact form-factor, ready-to-use computing solution called a Computer on Module (CoM) or System on Module (SoM) comprises application-neutral hardware and software for creating any embedded device. It includes the operating system, device drivers, and related BSPs in terms of software.
Microsoft Word is a well-known illustration of a module-based programe since it includes modules from Microsoft Paint that enable users to make illustrations or figures.
Modules are usually used to organise object definitions together that provide the same function in a business. For instance, a module may have all the processes and data types necessary for inventory management.
A single physical module called a “Computer on Module” (CoM), often referred to as a “System on Module” (SoM), contains several standard computer components.
A CPU, RAM, flash memory, a power management unit, an Ethernet bus, and Wi-Fi and Bluetooth radios are examples of typical CoM parts. The simplicity of final product designs is increased by the availability of all this hardware as a single unit.
COMPUTER ON MODULE MARKET SIZE AND FORECAST
The Global Computer on Module Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The demand for COMs has been influenced by the growing adoption of edge computing and the Internet of Things (IoT). COMs play a crucial role in providing the necessary computing power at the edge of networks, facilitating real-time data processing and reducing latency.
There has been a continuous trend toward incorporating more powerful processors and improving overall efficiency. COM manufacturers were focusing on providing modules with advanced CPUs, GPUs, and efficient power management to meet the increasing computational demands of diverse applications.
The COM market experiences rapid advancements in technology, with new generations of modules regularly introduced. This includes the adoption of the latest processor architectures, improved connectivity options, and enhanced multimedia capabilities.
COMs are designed to support a wide range of connectivity options, including various interfaces like USB, PCIe, Ethernet, and wireless technologies. This adaptability ensures compatibility with diverse peripherals and connectivity standards.
The demand for COMs has extended across various industries, including industrial automation, medical devices, automotive, and communication. This broad market applicability has contributed to the overall growth of the computer on module market.
10 new computer on module with 12th generation Intel Core processors are released by Congatec. The 12th Generation Intel Core mobile and desktop CPUs (previously code-named Alder Lake) are now available on 10 new COM-HPC and COM Express Computer-on-Modules from congatec, a prominent supplier of embedded and edge computing technologies.
The new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer significant performance increases and enhancements for the world of embedded and edge computing systems since they are equipped with the most recent high-performance cores from Intel. The ability for engineers to use Intel’s cutting-edge performance hybrid architecture is the most striking.
Additionally, compared to 11th Gen Intel Core processors, mobile BGA processors with up to 96 Execution Units of the integrated Intel Iris Xe GPU have been estimated to deliver extraordinary improvements in graphics performance of up to 129% for an immersive user experience. They can also process parallelized workloads more quickly, such as AI algorithms.
The graphics of the LGA processor-based modules give now up to 94% quicker performance and its image classification inference performance has nearly quadrupled with up to 181% greater throughput. These modules have been optimized for the greatest embedded client performance.
Congatec launched new Computer on Module featuring 13th Gen Intel Core processors. As the new processors with long life availability offer significant improvements in many features while being fully hardware compatible with the predecessors, which makes implementation very quick and simple, congatec anticipates that series production of OEM designs based on these new modules will ramp up quickly and massively.
The modules based on the new COM-HPC standard open up new frontiers for developers in terms of data throughput, I/O bandwidth, and performance density with Thunderbolt and improved PCIe support up to Gen5.
The COM Express 3.1 compliant modules primarily aid in protecting investments in current OEM designs, which feature upgrade possibilities for increased data speed due to PCIe Gen4 capability.
Comparing the soldered 13th Gen Intel Core processors to the 12th Gen Intel Core processors, the new COM-HPC and COM Express Computer on Modules offer performance advantages of up to 8% for single thread and up to 5% for multithread.
Due to an improved production process, the performance improvements coincide with a much-increased power efficiency. DDR5 memory compatibility and PCIe Gen5 connectivity on some SKUs are also new in this performance class (15-45 W Base Power).
The two together improve data throughput and multithread speed. The integrated Intel Iris Xe graphics architecture has ultra-fast encode and decode speeds and up to 80 EU, making it the perfect choice for applications that require enhanced graphics, like video streaming and situational awareness based on video data.
A wide range of industrial, medical, artificial intelligence (AI), and machine learning (ML) applications, as well as all forms of embedded and edge computing with workload consolidation, all significantly benefit from all these aspects.
These new generations of Computer on Modules are quite impressive because of the significant enhancements of the 13th Gen Intel Core CPUs What makes this new launch so incredibly important for all of their OEM customers and Value Adding Reseller partners is that they give industry the chance to rapidly update pre-existing high-end embedded and edge computing solutions.
Application engineers can use congatec’s Micro-ATX Application Carrier Board conga-HPC/uATX for COM-HPC Client type modules to install the new COM-HPC Computer on Modules to immediately take advantage of all the advantages and improvements of these new modules when used together.
SECO introduced Intel Atom processors x7000E Series, Intel Core i3 processors, and Intel Processors N Series-based computer on module (COM) that complies with SMARC Rel. 2.1.
This occurs concurrently with Intel releasing its platform for the newest generation of processors, for which SECO received early design data and processor silicon to hasten the development of its solution.
With outstanding AI acceleration at low power consumption, Intel Atom processors from the x7000E Series and Intel Core i3 processors set new standards for x86 processors in the 6W to 15W power range.
In order to boost throughput for deep learning audio processing and natural language processing, Intel® Deep Learning Boost with Vector Neural Network Instructions (VNNI) and Intel® Gaussian & Neural Accelerator (Intel® GNA) are two examples of multifaceted AI support.
