By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Applications for power supply units, sealing and shielding processes, and the aerospace, consumer electronics, and telecom equipment industries all rely heavily on thermal interface pads and materials. Because they contribute to cost-effectively increasing productivity, thermal interface pads and materials can be a cost-effective strategy for various industries.
The Thermal interface pads and materials market has benefited from technological advancements. The quality and accuracy of thermal interface pads and materials have been enhanced by these advancements.
In integrated circuits, heat is transferred between microprocessors and heat sinks with the help of thermal interface pads and materials. This market has been divided into type and application segments.
The aforementioned market has been divided into several types, including thermal grease, phase change material, and others. Application-based segments of the market include power supply units, telecom equipment, consumer electronics, and others.
This market is expected to have a huge growth potential due to their various benefits. The demand for telecom equipment industry is currently driving TIM market. This is mainly because of the huge demand for thermal interface pads & material in this sector
The Global Consumer electronics Silicone Thermal Interface Materials market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
With the electrification of automobiles, the demand for heat dissipation measures for lithium-ion batteries and for various other electronic control systems are increasingly becoming more sophisticated and diversified.
With the accelerating worldwide growth in vehicle electrification, the amount of thermal interface materials in automotive parts has increased and their applications are expanding. In response to this changing market environment, Shin-Etsu Chemical has developed two kinds of new products with unique characteristics.
Due to its significantly low density level that was achieved by employing our own unique technology, the “TC-PEN Series” realized about a 15% lighter weight when compared to conventional products, while also maintaining the same level of thermal conductivity characteristics and workability of conventional products.
As a result, this new product is lighter in weight and is superior in flexibility of handling, making it suitable for applications as a heat dissipation element in electronic devices with non-flat surfaces and in large area parts such as lithium-ion batteries.
