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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Copper wire bonding can sometimes provide more performance and dependability than gold wire bonding in many situations. For bonding in a ball/wedge procedure with a reduced protective gas atmosphere, copper bonding wires work fantastically. A wedge/wedge bonding procedure also permits processing.
The main benefits of copper wire bonding are that it is less expensive and more stable than gold, that it is stiffer (reducing wire sweep), that the development rates of the intermetallic alloy Al-Cu are significantly slower than those of the alloy Al-Au, and that it has better electrical conductivity.
The Global Copper Bonding Wires market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
New IConnPS ProCu PLUSTM and IConnPS ProCu PLUSTM LA Copper Wire Bonding from Kulicke & Soffa have been launched. With the new ProCu5 process, which provides the maximum level of Copper Process capability, the new IConnPS ProCu PLUSTM and IConnPS ProCu PLUSTM LA Copper Wire Bonders are equipped to bond copper wires.
Advanced wafer nodes under 28 nanometers may produce reliable copper wire bonds using the ProCu5 technique.
The regular 80mm bondable area with the option of an 87mm option is provided by the IConnPS ProCu PLUSTM Copper Wire Bonder. A factory-configured bondable area of 87mm is included with the IConnPS ProCu PLUSTM LA variant.
Customers may count on K&S to assist them overcome the difficulties in the copper wire bonding process at advanced silicon nodes. As the industry pioneer in the wire bond sector, K&S is dedicated to giving its clients access to dependable, cutting-edge technology solutions that improve their operations.
In order to provide its clients with a cost-of-ownership advantage and a high level of confidence in their products, the R&D team continuously innovates and develops new process techniques. K&S, a leader in this field, has been offering customers industry-leading packaging solutions for many years.
With the addition of wedge bonding and a wider variety of disposable tools to its core ball bonding goods in recent years, K&S has increased the scope of its product line through strategic acquisitions.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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