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Thermal grease is a Non-Solvent type of thermal interface material, it helps in thermal management requirements of high performance microprocessors. It is utilised to enhance the flow of heat between two surfaces that are in direct touch.
A thermal wheel is used in KyotoCooling, an improvement on free cooling, to regulate the flow of hot and cold air throughout the data centre. As the wheel turns, heated air from within is vented outside, where it is cooled by the outside air before being brought back into the building.
In essence, the data centre’s hardware and the environment’s heat are absorbed by the cooling system. Cool air or fluids replace the heated components to reduce the temperature of the hardware.A thickness of 100 m is indicated after the application of thermal grease.
Epoxies, silicones or silicone grease, urethanes, and acrylates, as well as solvent-based systems, hot-melt adhesives, and pressure-sensitive adhesive tapes, are examples of common matrix materials.The two primary categories of cooling systems are water- and air-cooled systems.
The Global Data centre thermal grease market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Chip-cooling breakthroughs will reduce data-center power costs. Future devices might stay 18 degrees cooler thanks to a new microprocessor manufacturing method, which would result in significant efficiency savings for data centres.
Currently, heat is conducted away from the chip by heatsinks, which are frequently constructed of several copper or aluminium fins and attached with thermal paste. They can achieve this in part because of their higher surface area compared to chip surfaces and utilisation of heat-conducting materials like aluminium. So, the chips can operate more quickly without overheating and breaking down. Typically, the heat is released into the air or into water.
That method’s inherent inefficiency is the problem. Although it is crucial to bridge the minuscule spaces between the heatsink and the chip (and also prevent the heat sink from slipping off), the adhesive, thermal interface material isn’t as effective as something fully seamless. That has been difficult up until now because, among other things, the heat sink wouldn’t cling and gaps would be produced, obstructing the heat pass-through.
