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Dynamic, random-access memory integrated circuits make up a dual inline memory module (DIMM) socket. They are attached to a printed circuit board (PCB). The pin count is 240 pins for DDR2 and DDR3 DIMM sockets and 288 pins for DDR4 and DDR5 DIMM sockets.
Dual Date RateSDRAM, sometimes known as DDR, is an enhanced version of SDR. It is a good idea to have a backup plan just in case. DDR ‘s first mainstream capacities range from 128MB to 1GB, and its initial mainstream frequency is 400MHz. Later, after the bandwidth had doubled, DDR began to enable dual-channel.
A memory module called an Unbuffered DIMM is made for desktop computers and entry-level workstations. A memory module called a Registered DIMM is made for high-end workstations and network servers.
The Global DDR DIMM Connector plastics market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Next-Generation DDR-DIMM Sockets Use Nylon 4T According to DSM, Stanyl ForTii nylon 4T is the only high-temperature, halogen-free nylon that satisfies the exacting standards of reflow soldering for DDR-DIMM sockets.
Major OEMs who have begun using DDR3-DIMM (dual in-line memory module) sockets in the most recent generation of blade servers have chosen Stanyl ForTii nylon 4T from DSM Engineering Plastics, Birmingham, Michigan.
According to reports, the DSM material is now the only halogen-free, high-temperature nylon that can reportedly reflow solder DDD3 sockets while also meeting demands for high melt flow in intricate moulds and incredibly minimal warpage in completed products.
The redesigned chassis design and the temperature, power, and airflow characteristics of the blade servers of the next generation place a more demanding set of requirements on components. For example, to account for the use of DIMMs including a greater number of chips, they need components with a low height.
Additionally, specifiers prefer plastics that are completely devoid of halogen or red phosphorus-based flame retardants. They also desire good colorability to differentiate DDR3-DIMM sockets.
All of these requirements are met by Stanyl ForTii, which is also appropriate for wave and reflow soldering. It was tested with several LCPs (liquid crystal polymers) and PPAs before being chosen for a new generation of ULP DDR3 sockets (polyphthalamide).
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