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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Deep Silicon Etching (DSiE), also known as Deep Reactive Ion Etching of Silicon (DRIE), is a highly anisotropic etching technique used to make deep pits and holes in wafers and other substrates, frequently with large aspect ratios.
The Bosch and Cryogenic Processes are the two methods utilized in the manufacture of Micro-Electro-Mechanical Systems (MEMS) to obtain deep engravings. Although system and process development over a long period of time has allowed for the advancement of approaches, the core elements of each remain the same.
The Global Deep Reactive Ion etch market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
In order to meet a wide range of process needs in the Micro Electromechanical Systems (MEMS), Advanced Packaging, and Nanotechnology businesses, the PlasmaPro 100 Estrelas platform is made to offer complete flexibility for Deep Reactive Ion Etching (DRIE) applications.
The PlasmaPro 100 Estrelas, which was created for research and mass production, provides the utmost versatility with Bosch and Cryogenic processes.
Good etch rate and high selectivity with Bosch method are some of the benefits. processes with a smooth sidewall and a high aspect ratio high degree of vertical anisotropy, Nano-silicon etch and notch control (SOI) at low rate, low power through engravings, tapered a variety of applications,
Depending on the compatibility of the substrates, mechanical or electrostatic clamping an increase in reproducibility, lengthened the mean time between cleans (MTBC).
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |