Global Die Attached Adhesives Market 2024-2030
  • CHOOSE LICENCE TYPE
Consulting Services
    How will you benefit from our consulting services ?

Global Die Attached Adhesives Market 2024-2030

Last Updated:  Apr 25, 2025 | Study Period: 2024-2030

DIE ATTACHED ADHESIVES MARKET

 

INTRODUCTION

Adhesives for die attach are used to secure semiconductor chips to the surfaces of packaging. They can aid in establishing the attachment and reducing tension and warpage while the device is in operation. Some die attach adhesives have been designed to be both electrically insulating and thermally conducting.

 

The process of connecting a semiconductor die to a packaging, a substrate like a PCB board, or another die is known as die attach or die bonding. The die attach procedure is crucial to many different kinds of packaging. 

 

DIE ATTACHED ADHESIVES MARKET SIZE AND FORECAST

 

Infographic: Die Attached Adhesives Market , Die Attached Adhesives Market Size, Die Attached Adhesives Market Trends,  Die Attached Adhesives Market Forecast, Die Attached Adhesives Market Risks, Die Attached Adhesives Market Report, Die Attached Adhesives Market Share

 

 The Global Die attached adhesives market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

DIE ATTACHED ADHESIVES MARKETNEW PRODUCT LAUNCH

Henkel introduces a die-attach adhesive with ultra-high heat conductivity.Loctite Ablestik ABP 8068TI has been added by Henkel to its expanding line of high-thermal die-attach adhesives.

 

The new pressure-free sintering die-attach paste has the highest thermal capability in the company's range of semiconductor packaging, boasting 165 W/m-K thermal conductivity. It meets the performance criteria for highly reliable automotive and industrial power-discrete semiconductor devices.

 

For better efficiency, power semiconductors like MOSFETs are increasingly combining silicon carbide (SiC) and gallium nitride (GaN) materials as alternatives to silicon (Si), and Henkel's newest pressureless sintering die-attach formulation satisfies these requirements.

 

Other power-discrete devices, such as modern wide-bandgap semiconductors, are compatible with Loctite Ablestik ABP 8068TI.

 

The 165 W/m-K ultra-high thermal conductivity die-attach adhesive has shown excellent sintering characteristics with good adhesion on copper (Cu), pre-plated frames (PPF), silver (Ag), and gold (Au), robust electrical conductivity and stable RDS(on) after 1,000 hours of thermal cycling, and MSL 3 reliability.

 

Loctite Ablestik ABP 8068TI completely cures at 175° C or above to generate a hard sintered Ag network in the bulk epoxy and at the interface. It is advised for dies measuring 3.0 x 3.0 mm or less.

 

High pressure is not necessary to generate this strong structure since pressureless sintering may be used as a drop-in substitute for conventional die attach, which reduces stress on thin die. The material's workability is noteworthy at three hours of void-free open time and 24 hours of staging without a loss in shear strength.

 

DIE ATTACHED ADHESIVES MARKETCOMPANY PROFILE

 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS OFDIE ATTACHED ADHESIVES MARKET

  1. How many Die attached adhesives are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global Die attached adhesives and key vendor selection criteria
  3. Where is the Die attached adhesives manufactured? What is the average margin per unit?
  4. Market share of Global Die attached adhesives market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global Die attached adhesives in-house
  6. key predictions for next 5 years in Global Die attached adhesives market
  7. Average B-2-B Die attached adhesives market price in all segments
  8. Latest trends in Die attached adhesives market, by every market segment
  9. The market size (both volume and value) of the Die attached adhesives market in 2024-2030 and every year in between?
  10. Production breakup of Die attached adhesives market, by suppliers and their OEM relationship

 

Sl no Topic 
Market Segmentation 
Scope of the report 
Abbreviations 
Research Methodology 
Executive Summary 
Introdauction 
Insights from Industry stakeholders 
Cost breakdown of Product by sub-components and average profit margin 
Disruptive innovation in theIndustry 
10 Technology trends in the Industry 
11 Consumer trends in the industry 
12 Recent Production Milestones 
13 Component Manufacturing in US, EU and China 
14 COVID-19 impact on overall market 
15 COVID-19 impact on Production of components 
16 COVID-19 impact on Point of sale 
17 Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 
18 Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 
19 Market Segmentation, Dynamics and Forecast by Application, 2024-2030 
20 Market Segmentation, Dynamics and Forecast by End use, 2024-2030 
21 Product installation rate by OEM, 2023
22 Incline/Decline in Average B-2-B selling price in past 5 years 
23 Competition from substitute products 
24 Gross margin and average profitability of suppliers 
25 New product development in past 12 months 
26 M&A in past 12 months 
27 Growth strategy of leading players 
28 Market share of vendors, 2023
29 Company Profiles 
30 Unmet needs and opportunity for new suppliers 
31 Conclusion 
32 Appendix