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In order to remove material from the exposed surfaces, dry etching typically uses an ion bombardment (often a plasma of reactive gases) to remove and etch a masking pattern of semiconductor material. Condensation and high amounts of byproducts from this process could impair the dependability and performance of vacuum valves.
The mass production of multilayer stacks using dry etching methods necessitates the use of the best sealing technology (with self-cleaning functionality) and the most durable tool design possible.
The Global Display dry etcher equipment market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The launch of the Impressio 3300 PICP, a dry etch system with a high density plasma source that enables high resolution processing of G10.5 (2,940 mm x 3,370 mm) glass substrates, was announced by Tokyo Electron (TEL). With the commercial release of 8K TVs, the flat panel display (FPD) industry has been improving the resolution of large liquid crystal display (LCD) devices. The manufacture of organic light-emitting diode (OLED) screens is also being boosted by the demand for high quality displays.
Typically, the driver circuits of many of these advanced displays are powered by oxide semiconductors. Dry etch systems for oxide semiconductors must provide a faster etch rate, better within-substrate uniformity, and higher yield than current equipment because oxide semiconductor production processes demand greater precision and efficiency compared to amorphous silicon processes, which have traditionally been the standard for large panels.
A high density plasma source, specifically designed and created by TEL to meet the cutting-edge technology requirements of oxide semiconductors and other innovative devices, is a feature of the PICP etch module. The PICP module delivers a considerable gain in productivity and process uniformity with lower running costs than its predecessor, ICP-duo, and is 20% more energy efficient in terms of plasma process.
It may be utilised to create high-definition LCDs and OLED displays. The recently announced Impressio 3300 PICP is a novel dry etch system that adds the PICP module to G10.5 panel processing.
