GLOBAL DOUBLE SIDED MOLDED BALL GRID ARRAY PACKAGE MARKET

INTRODUCTION

 An integrated circuit is packaged using a surface-mount device called a Double Sided Molded Ball Grid Array Package, sometimes known as a chip carrier. Devices like microprocessors are permanently mounted using Double Sided Molded Ball Grid Array Package. A Double Sided Molded Ball Grid Array Package can offer more connector pins than a dual in-line or flat package can accommodate. Instead of simply the edge, the entire bottom surface of the gadget can be used. Additionally, compared to a perimeter-only type, the traces connecting the package's leads to the wires or balls that connect the die to the package are typically shorter, improving performance at high speeds.Double Sided Molded Ball Grid Array Package device soldering necessitates precise control and is typically accomplished by automated techniques, like those found in computer-controlled automatic reflow ovens.

GLOBAL DOUBLE SIDED MOLDED BALL GRID ARRAY PACKAGE MARKET SIZE AND FORECAST

The Global Double Sided Molded Ball Grid Array Package market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

Amkor has created a Double Sided Molded Ball Grid Array (DSMBGA) package that enables molded assembly of components on both sides of the substrate in order to further enhance the integration and resilience of RFFE solutions. In order to package RF front-end modules for smartphones and other 5G-enabled devices, creative solutions are needed because the cellular frequency bands have expanded significantly with the development of 5G. One of the best examples of such solutions is Amkor's Double Sided Molded Ball Grid Array Package. Amkor was the first OSAT to offer DSMBGA, building on years of experience in providing top-tier innovative System in Package (SiP) technology, and it continues to pave the way for new developments.

The level of integration for RF front-end modules used in smartphones and other mobile devices has significantly risen thanks to Amkor's double-sided packaging method. Low noise amplifiers (LNA), power amplifiers, RF switches, RF filters, and duplexes make up the majority of RF front-end modules.With compartmental or conformal shielding, the Double Sided Molded Ball Grid Array Package enables the molded assembly of active, passive, and antenna tuner components on both sides of the substrate.

COMPANY PROFILE

• Amkor Technology
• TriQuint Semiconductor Inc.
• Jiangsu Changjiang Electronics Technology Co.
• STATS ChipPAC Ltd.
• ASE Group,

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Double Sided Molded Ball Grid Array Packages are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Double Sided Molded Ball Grid Array Package and key vendor selection criteria
3. Where is the Double Sided Molded Ball Grid Array Package manufactured? What is the average margin per unit?
4. Market share of Global Double Sided Molded Ball Grid Array Package market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Double Sided Molded Ball Grid Array Package in-house
6. key predictions for next 5 years in Global Double Sided Molded Ball Grid Array Package market
7. Average B-2-B Double Sided Molded Ball Grid Array Package market price in all segments
8. Latest trends in Double Sided Molded Ball Grid Array Package market, by every market segment
9. The market size (both volume and value) of the Double Sided Molded Ball Grid Array Package market in 2023-2030 and every year in between?
10. Production breakup of Double Sided Molded Ball Grid Array Package market, by suppliers and their OEM relationship