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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Double-sided PCBs are used in many everyday gadgets. Single-sided PCBs have one conductive surface, but double-sided PCBs have one on each side. On both sides, a dielectric layer is surrounded by circuit copper layers and a solder mask.
A two-layer PCB (double-sided PCB) is a printed circuit board that has copper coating on both sides, top and bottom. In the middle lies an insulating layer, which is a regularly used printed circuit board.
Because both sides may be planned and soldered, it considerably decreases layout difficulties and is frequently utilised.
Household appliances, mobile phones, laptops, lighting systems, amplifiers, and vending machines all employ double-sided PCBs.
They are suitable for mass production of fixed circuits and provide a higher level of reliability.
The Global Double Sided Printed Circuit Board market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
KLA Introduces a New Double-Sided Direct Imaging Platform to Support Continued Innovation in PCBs and IC Substrates The Orbotech Corus DI platform offers a fully automated and expandable solution for highly accurate and efficient patterning procedures.
KLA Corporation today presented the new Orbotech Corus 8M direct imaging (DI) solution, the first system built on the all-in-one innovative Orbotech Corus platform, combining the capability and automation of a full direct imaging production line in a closed, clean, and compact unit.
The extendable Orbotech Corus DI platform is unique in its ability to enable extremely efficient double-sided imaging in a fully automated solution optimised for high throughput and capacity. It provides higher resolution with excellent precision to pattern finer lines.
PCB and IC substrate makers are assisting electronic device OEMs in packaging additional functionality into their premium goods while supporting a variety of form factors, which necessitates increasing the density of transmission lines for advanced high-density interconnect PCBs and IC substrates.
The all-new Orbotech Corus DI platform provides this exact line forming capability at manufacturing throughput speeds and has demonstrated effectiveness in customer installations.
KLA's continuous investments in precision DI technology will extend to future Orbotech Corus Series solutions as well, with more advancements for improved accuracy and resolution expected in the next few years to continue enabling the IC substrate technological roadmap.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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