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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A modulator is an electrical circuit used to wirelessly transmit data by superimposing a low-frequency (information) signal on a high-frequency (carrier) signal.
The modulator driver is a high bandwidth amplifier constructed using a cascade of MMICs (Monolithic Microwave Integrated Circuits) based on Gallium Arsenide (GaAs) technology and on a distributed amplifier topology, and it is intended to drive an optical modulator under the most favourable circumstances.
The Global driver-controlled modulator market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Coherent Driver Modulator (HB-CDM) with SOA and 69 Gbaud Symbol Rate. The Lumentum high-bandwidth coherent driver modulator (HB-CDM) is an integrated part for coherent applications that complies with OIF standards.
It has a four-channel driver integrated circuit that is co-packaged with two nested modulators and is made to modulate the amplitude and phase of the input light in both polarizations.
To lessen insertion loss or to balance power between the two polarizations, Mach-Zehnder (MZ) structures incorporate semiconductor optical amplifiers (SOAs). The gadget has two current-controlled SOAs for each polarisation.
With this setup, it is possible to create transceivers with a single laser divided between the transmitter and local oscillator. A thermoelectric cooler regulates the temperature of the InP modulators.
Analog voltage inputs to the module are used to control the modulators. SPI digital control interface and analogue control signals are used to control the driver.
The system has monitoring photodiodes that gauge power and offer feedback for feedback loops.One input fibre (from a CW laser) and one output fibre make up the module.
The RF input contacts have a GSSG pattern and are situated at the back of the package, across from the fibres. Power supply, control signals, and the digital SPI interface are provided through 40 low-speed connections on the side of the package.
The mechanical outline of the HB-CDM is the typical OIF Type 1 MSA size (30 mm x 12 mm x 6.5 mm). The 40-pin connector provides electrical interfaces.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |