GLOBAL DRY-ETCHING EXHAUST GAS TREATMENT EQUIPMENT MARKET

INTRODUCTION

 Dry etching is now employed in semiconductor fabrication procedures due to its superior ability to undertake anisotropic etching (material removal) to build high aspect ratio structures (e.g. deep holes or capacitor trenches) over wet etching.

The technique of eliminating a masking pattern of semiconductor material by hitting it with ions is known as dry etching, sometimes known as plasma etching. A plasma of reactive gases, such as oxygen, boron, fluorocarbons, chlorine, and trichloride, often makes up the ions.

After metallographic grinding and polishing procedures, etching is a chemical or electrolytic process used. Using etching to increase surface contrast will allow you to see the microstructure or macrostructure.

GLOBAL DRY-ETCHING EXHAUST GAS TREATMENT EQUIPMENT MARKET SIZE AND FORECAST

The Global Dry-etching exhaust gas treatment equipment market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

RECENT DEVELOPMENT

Factor Design for the Oxide Etching Process to Reduce Edge Particle Contamination in Capacitively Coupled Plasma Etching Equipment. Particles stuck to the wafer edge by capacitively coupled plasma etching equipment during the oxide layer etching procedure result in flaws that lower the yield of semiconductor wafers.

Adjusting the voltage and temperature of the electrostatic chuck, the plasma discharge sequence, the gas flow, and the pressure parameters during the etching process to lessen edge particle contamination in plasma etching equipment. By examining particle maps after wafer etching, the proposed edge particle reduction method was created. 

By lowering the voltage and temperature variations of the electrostatic chuck and producing a plasma sheath with a continuous discharge sequence of radio-frequency plasma, edge particle adhesion in plasma etching equipment may be decreased.

The quantity of wafer edge particles is also influenced by the gas pressure and flow rate. The equipment settings were improved using experimental data in order to decrease edge particle contamination and enhance edge wafer defects after dry etching.

COMPANY PROFILE

• Suzhou Delphi Laser Co. Ltd.
• Lam Research
• Plasma-Therm, LLC
• Hitachi High-Technologies Corporation
• Panasonic Corporation

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Dry-etching exhaust gas treatment equipment are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Dry-etching exhaust gas treatment equipment and key vendor selection criteria
3. Where is the Dry-etching exhaust gas treatment equipment manufactured? What is the average margin per unit?
4. Market share of Global Dry-etching exhaust gas treatment equipment market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Dry-etching exhaust gas treatment equipment in-house
6. key predictions for next 5 years in Global Dry-etching exhaust gas treatment equipment market
7. Average B-2-B Dry-etching exhaust gas treatment equipment market price in all segments
8. Latest trends in Dry-etching exhaust gas treatment equipment market, by every market segment
9. The market size (both volume and value) of the Dry-etching exhaust gas treatment equipment market in 2023-2030 and every year in between?
10. Production breakup of Dry-etching exhaust gas treatment equipment market, by suppliers and their OEM relationship