Global Dry-Etching Exhaust Gas Treatment Equipment Market Size, Share, Trends and Forecasts 2031

Key Findings

• Dry-etching exhaust gas treatment equipment plays a vital role in controlling harmful byproducts from semiconductor manufacturing, particularly during plasma etching and other dry-etching processes.

• These systems are essential for removing hazardous gases such as perfluorinated compounds (PFCs), hydrogen bromide, sulfur hexafluoride, and byproducts like silicon tetrafluoride.

• The rise in advanced semiconductor fabrication nodes (5nm, 3nm, and below) is leading to more intensive etching cycles, significantly increasing exhaust treatment requirements.

• As environmental regulations tighten globally, fabs are investing in sophisticated exhaust gas treatment solutions to meet emission standards and reduce their ecological footprint.

• Key technologies used include combustion, plasma decomposition, wet scrubbing, and catalyst-based neutralization, often deployed in hybrid configurations.

• Asia-Pacific holds the largest market share due to the concentration of fabs in countries such as Taiwan, South Korea, China, and Japan.

• Equipment with modular and automated control features is gaining popularity for its ease of integration and maintenance in complex cleanroom environments.

• Major players include Ebara Corporation, Global Standard Technology, Edwards Vacuum, DAS Environmental Expert, and CS Clean Solutions.

• The trend toward zero-emission fabs and green manufacturing is accelerating the adoption of energy-efficient, high-throughput exhaust treatment equipment.

• R&D efforts focus on improving process gas selectivity, reducing thermal load, and integrating with digital monitoring systems for real-time compliance.

Market Overview

The dry-etching exhaust gas treatment equipment market is a critical subsegment of the broader semiconductor equipment ecosystem. These systems are designed to capture and neutralize hazardous effluents generated during plasma-based dry-etching processes, which are essential in defining intricate patterns on wafers during chip manufacturing.

As semiconductor technology nodes continue to shrink, the use of high-density plasma etching with aggressive chemistries such as fluorinated gases and halogen compounds has intensified. These processes result in the generation of complex gaseous byproducts that pose both environmental and safety risks. To address these challenges, fabs deploy advanced gas abatement systems capable of handling a wide spectrum of toxic, corrosive, and reactive gases.

Dry-etching exhaust gas treatment equipment combines technologies such as thermal decomposition, wet scrubbing, catalytic oxidation, and plasma-based abatement to ensure emission compliance and maintain cleanroom integrity. In addition to meeting regulatory standards, these systems protect downstream vacuum pumps, reduce tool downtime, and contribute to sustainability objectives across fab operations.

Dry-Etching Exhaust Gas Treatment Equipment Market Size and Forecast

The global dry-etching exhaust gas treatment equipment market was valued at USD 920 million in 2024 and is expected to reach USD 2.1 billion by 2031, growing at a CAGR of 12.7% over the forecast period.

Growth in this market is closely tied to semiconductor capital expenditures, particularly in front-end fabs focused on logic and memory. With the increasing complexity of etching processes, fabs are now integrating point-of-use (POU) gas abatement systems as a standard component in etching chambers.

The surge in fab construction across Asia-Pacific, driven by domestic semiconductor policies in China, Taiwan, and India, is a key growth driver. Furthermore, environmental compliance requirements under protocols like the Kyoto Protocol and EU F-Gas Regulation are compelling fabs in North America and Europe to invest in upgraded gas treatment technologies.

Future Outlook

The future of this market will be shaped by both regulatory pressure and the growing emphasis on sustainable fab operations. Next-generation systems will incorporate energy recovery features, adaptive flow controls, and digital interfaces for precise exhaust gas analytics. Autonomous calibration and predictive maintenance functions will further enhance uptime and process yield.

The development of green fabs with net-zero carbon goals will drive demand for systems that offer high abatement efficiency with minimal power consumption. Integration with factory-wide environmental management systems will enable centralized monitoring of emission metrics, facilitating ESG reporting and environmental auditing.

As materials evolve for future nodes (e.g., gate-all-around, 2D semiconductors), the demand for specialized abatement solutions tailored to new chemistries will rise. Collaborative R&D among fabs, tool manufacturers, and exhaust system OEMs will be crucial to address novel etching byproducts in the upcoming decade.

Dry-Etching Exhaust Gas Treatment Equipment Market Trends

• Hybrid Abatement Systems for Complex Chemistries
  Increasing process complexity in etching is driving demand for hybrid gas treatment systems that combine thermal oxidation, plasma cracking, and wet scrubbing. These systems are optimized to handle a wide range of gaseous compounds with varying reactivity, minimizing both emission levels and maintenance frequency.

• Digital Monitoring and Predictive Maintenance
  Advanced systems are now equipped with IoT sensors and AI-based diagnostics to continuously monitor flow rates, pressure, temperature, and gas composition. Predictive maintenance algorithms use this data to identify potential system failures before they occur, reducing downtime and extending equipment lifespan.

• Localized Point-of-Use (POU) Installations
  Point-of-use gas treatment units are increasingly preferred for their ability to manage exhaust gases directly at the tool level. These systems reduce piping complexity, allow tool-specific control, and help meet localized cleanroom requirements, especially in 3D NAND and advanced logic fabs.

• Focus on Low Energy and Water Consumption
  Sustainability concerns are prompting fabs to adopt abatement systems that minimize utility usage. Manufacturers are developing low-energy plasma torches, dry-scrubbing modules that eliminate water use, and systems that recover heat for reuse elsewhere in the fab environment.

• Material Compatibility for Advanced Nodes
  As new materials like hafnium, cobalt, and ruthenium are used in sub-5nm nodes, exhaust systems must be compatible with complex halogenated byproducts. Vendors are investing in material science to improve corrosion resistance and chemical reactivity within abatement chambers.

Market Growth Drivers

• Proliferation of Advanced Semiconductor Fabs
  The ongoing expansion of semiconductor manufacturing capacity, particularly in Asia-Pacific and the U.S., is directly increasing the number of etching tools in operation. Each etching tool requires dedicated gas abatement systems, thus driving the market for dry-etching exhaust gas treatment equipment.

• Stricter Environmental Regulations
  Regulatory bodies worldwide are enforcing tighter emission norms for global warming gases and toxic pollutants. Fabs must invest in high-efficiency gas treatment systems to comply with national and international standards such as EPA Clean Air Act, REACH, and RoHS.

• Increased Etching Cycles in Advanced Nodes
  As chip architectures become more complex (e.g., FinFET, GAA), the number and intensity of etching steps per wafer increase. This leads to higher exhaust volumes and more diverse byproducts, thereby escalating the need for robust, multi-stage abatement systems.

• Corporate ESG Commitments and Green Fab Initiatives
  Leading foundries are aligning with net-zero and sustainability goals, prompting capital investments in cleaner manufacturing technologies. Exhaust gas treatment equipment plays a central role in these strategies by reducing GHG emissions and chemical waste discharge.

• Rise of 3D Structures and New Material Stacks
  The introduction of 3D architectures such as 3D NAND and DRAM stacking requires deeper, more aggressive etching steps using exotic chemistries. These processes demand highly specialized abatement technologies capable of handling volatile, sticky, and corrosive effluents.

Challenges in the Market

• High Capital and Operational Costs
  State-of-the-art abatement systems require significant initial investment and ongoing operational expenses related to utilities, spare parts, and compliance monitoring. This can be a financial burden, especially for smaller fabs or foundries with thin profit margins.

• Corrosive and Sticky Byproducts
  Advanced etching processes produce byproducts that are both corrosive and prone to deposition within gas lines. Maintaining optimal performance of abatement systems requires frequent cleaning and part replacement, impacting fab productivity and throughput.

• Complexity of Multi-Chamber Tool Integration
  With modern etching tools housing multiple chambers and requiring individual exhaust lines, integration of gas treatment units becomes logistically complex. Coordinating airflow, backpressure, and real-time control across chambers adds to the design challenge.

• Evolving Chemical Profiles of Etch Processes
  As semiconductor manufacturers experiment with new chemistries for advanced patterning, exhaust systems must adapt quickly. The lack of standardization in gas compositions and reaction pathways requires continuous R&D investment from equipment vendors.

• Maintenance Downtime and Cleanroom Constraints
  Exhaust gas treatment systems often operate in restricted cleanroom zones, making scheduled maintenance a challenge. Unplanned downtime due to system failure can interrupt fab operation and delay wafer production, leading to revenue losses.

Dry-Etching Exhaust Gas Treatment Equipment Market Segmentation

By Technology

• Thermal Oxidation Systems

• Wet Scrubbing Systems

• Plasma-Based Abatement Systems

• Catalytic Conversion Systems

• Hybrid Exhaust Treatment Systems

By Application

• Logic Device Fabrication

• Memory (DRAM, NAND) Fabrication

• Compound Semiconductor Manufacturing

• R&D and Pilot Lines

• Foundry Services

By Material Compatibility

• Fluorine-based Gases

• Chlorine-based Gases

• Bromine and Iodine Compounds

• Silicon-based Particulates

• Mixed Acidic and Corrosive Effluents

By Installation Type

• Point-of-Use (POU) Systems

• Centralized Exhaust Treatment Units

By Region

• North America

• Europe

• Asia-Pacific

• Latin America

• Middle East & Africa

Leading Key Players

• Ebara Corporation

• Edwards Vacuum (Atlas Copco)

• Global Standard Technology

• DAS Environmental Expert GmbH

• CS Clean Solutions

• EcoSys Corp.

• Kanken Techno Co., Ltd.

• Kokusai Electric

• Pfeiffer Vacuum Technology AG

• SEMES Co., Ltd.

Recent Developments

• Ebara Corporation unveiled a next-generation hybrid gas abatement system that combines plasma and catalytic technologies to improve efficiency for sub-3nm etch tools.

• Edwards Vacuum launched its iXH series with enhanced corrosive gas handling and digital diagnostics tailored for advanced logic and DRAM fabs.

• Global Standard Technology expanded its production capacity in South Korea to meet demand from leading foundries investing in 3nm and 2nm process nodes.

• CS Clean Solutions partnered with a major U.S.-based fab to deploy centralized exhaust gas scrubbers with real-time emissions monitoring capabilities.

• DAS Environmental Expert GmbH introduced an AI-integrated wet scrubber designed for dynamic gas mixtures in multi-patterning etch processes.