GLOBAL DUAL FLAT NO LEAD PACKAGING MARKET

INTRODUCTION

The Dual Flat No Leads packaging, or DFN, is a tiny, surface-mount plastic box with no leads that is square or rectangular. Electrical supply points with the outside environment are provided via metal pads or lands across two sides of such bottom of the DFN package.

The DFN and QFN are comparable; however, the latter has lands all the way from around product's perimeter as opposed to the DFN's two sections. Pad counts for DFN packages typically range from 3 to 32. The length of a common DFN body size is between 2 and 7 mm.

DUAL FLAT NO LEAD PACKAGING MARKET DEVELOPMENTS AND INNOVATIONS

The consumer electronics and automotive sectors are expected to experience rapid growth in the years to come. This noteworthy development is attributed to a wider variety of trend-setting inventions, such as wearable technology and electronic car accessories.

Wearable technology includes small electronic devices like wristwatches, personal medical checkers, and other items that are widely used by customers, generating interest in low-cost packages like UQFN or QFN.

Additionally, almost all auto manufacturers offer extras like keyless bolts and open frames for vehicle doors. These devices increase interest in QFN bundle. As a result, businesses have a great opportunity to contribute to these causes and invest in the development of new products.

COMPETITIVE LANDSCAPE

This substantial development is attributed to increased adoption of inventions that set trends, such wearable technology and electronic car accessories.

Wearable technology includes small electronic devices like wristwatches, personal medical monitoring devices, and others that are widely used by customers, igniting interest in packages seen as conservative. Additionally, almost all auto manufacturers offer extras like keyless bolts and open frames for vehicle doors. These devices increase interest in QFN bundle. 

OSE is a leading mobiliser of the equipment in the market. The latest integration has been in comparison to conventional leaded packages, the package structure provides a cost-effective packaging approach that minimises package size and improves thermal and electrical performance.

Thin profile Dual Flat No lead package refers to the DFN package with leads on both sides of the perimeter and with lead heights less than 0.025mm, 1.0mm, and more than 0.8mm (TDFN).

MAPCB is part of the component manufacture trending companies in the current industry. The black semiconducting epoxy moulding compound called Hysol GR900 Series is intended to encase and preserve quad-flat no-leads (QFN) and dual-flat no-leads (DFN).

GR900 was created with the lowest internal stress possible to prevent warpage, the best moldability possible, and the lowest moisture absorption possible to improve MSL performance. It performs with good dependability in a QFN package and is excellently compatible with copper wire.

COMPANIES PROFILED

• ASE(SPIL)
• Amkor Technology
• JCET Group
• Powertech Technology Inc.
• Tongfu Microelectronics
• Tianshui Huatian Technology
• UTAC
• Orient Semiconductor
• ChipMOS
• King Yuan Electronics
• SFA Semicon
• Arkema S.A.