EDGE COUPLER MARKET

INTRODUCTION

A mirror array and an optical bench are both features of an edge coupler. Incident light is bent, reflected, or otherwise altered by each mirror.

A PIC chip's optical components, which direct light to the chip's edge, are optically connected to the edge coupler. An optical fibre array and a PIC chip are passively coupled by an edge coupler that is demountable and alignable.

The edge coupler may be a free space edge coupler with no optical elements in between the mirror array and the PIC chip's optical elements, or it may have grooves that each receive a piece of optical fibre with its longitudinal axis parallel to the first light path and that end nearly at or extend beyond the edge of the edge coupler.

Multiple unidirectional tapers are arranged in different layers of an edge coupler based on multi-stage tapers, with their wide ends close to the fibre and their narrow ends close to subsequent photonic waveguides.

EDGE COUPLER MARKETSIZE AND FORECAST

The Global Edge Coupler market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

EDGE COUPLER MARKETRECENT PRODUCT DEVELOPMENT AND INNOVATION

The edge coupler launched LP01 and LP11 modes over a 90-nm bandwidth with minimal loss and crosstalk. Over 40 m of dual-mode fibre, 2100-Gbps/lambda PAM4 MDM transmission was also demonstrated. Broadband WDM can be used to boost capacity even further.

It has been revealed by CompoundTek Pte Ltd that it is working on an 8"/12" flexible silicon photonics wafer test hub. Wafer-level edge coupling capability and test time reduction for commercial product firms will be the two main market demands that will be the focus of expansion. 

CompoundTek Pte Ltd, a Singapore-based provider of silicon photonic (SiPh) foundry services, has announced that it is working on an 8"/12" independent silicon photonics wafer test hub. Wafer-level edge coupling capability and test time reduction for commercial product firms will be the two main market demands that will be the focus of expansion.

Contrary to the real end-application, which couples light into the device horizontally through the coupler at the edge of the die, silicon photonic wafer testing now involves vertical optical coupling of the light into the device under test (DUT).

The requirement for real-world-based test scenarios to weed out failures is reinforced by the frequent occurrence of gaps in SiPh test coverage caused by a mismatch between the wafer test environment and the intended application.  With the development of new wafer edge coupling technologies, CompoundTek hopes to expand the scope of SiPh wafer testing by adding the detection of edge coupler-related failures.

The wafer-level edge coupling technology is being developed in tandem with the company's Test Executive Systems growth activities and is expected to be made available to significant clients in the first quarter (TES). The long test time per wafer, which can range from 36 hours to as long as 96 hours depending on the test type required and coverage, is in contrast to the well-established CMOS logic product supply chain and poses a significant barrier to SiPh adoption on a larger scale.

The complex opto-electrical (DC and RF) tests are to blame for the lengthy test times, and without a standardised SiPh wafer test solution that can balance test coverage with short test times, it will take longer to successfully integrate optical components on a chip for SiPh devices, which will delay the adoption of SiPh technologies on a large scale.

CompoundTek claims that new developments in the optimization of its in-house TES executive may be able to minimise the time required to test products for customers by up to 40%, to as little as 1.5 hours (from 2.5 hours) or 70 hours (from 96 hours).

TES seeks to hasten the market adoption of wafer-level SiPh test services by enabling enormous volumes of device-performance data required to take a design from idea to qualification and then into production.

EDGE COUPLER MARKETCOMPANY PROFILE

• Compoundtek Pte Ltd
• TEEM PHOTONICS
• IBM
• FormFactor Inc.
• ePIXfab
• Applied Nanotools Inc.

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS OFEDGE COUPLER MARKET

1. What is the average cost perGlobal Edge Coupler marketright now and how will it change in the next 5-6 years?
2. Average cost to set up aGlobal Edge Coupler marketin the US, Europe and China?
3. How manyGlobal Edge Coupler marketare manufactured per annum globally? Who are the sub-component suppliers in different regions?
4. What is happening in the overall public, globally?
5. Cost breakup of aGlobal Edge Coupler marketand key vendor selection criteria
6. Where is theGlobal Edge Coupler marketmanufactured? What is the average margin per equipment?
7. Market share ofGlobal Edge Coupler marketmanufacturers and their upcoming products
8. The most important plannedGlobal Edge Coupler marketin the next 2 years
9. Details on the network of majorGlobal Edge Coupler marketand pricing plans
10. Cost advantage for OEMs who manufactureGlobal Edge Coupler marketin-house
11. 5 key predictions for the next 5 years in theGlobal Edge Coupler market
12. Average B-2-BGlobal Edge Coupler marketprice in all segments
13. Latest trends in theGlobal Edge Coupler market, by every market segment
14. The market size (both volume and value) of theGlobal Edge Coupler marketin 2024-2030 and every year in between?
15. Global production breakup of theGlobal Edge Coupler market, by suppliers and their OEM relationship