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C0ming Soon
A photodetector used to identify obstructions in light beams is called an electric eye. An application of this is the door safety system found on garage door openers, which uses a light transmitter and receiver at the bottom of the door to stop it from closing if anything is in the way and breaks the light beam.
Only the presence of light may be detected by the gadget; no image is produced. Although infrared radiation can be utilised instead of visible light, it is more frequently used in modern systems since it hides how the device works.
The Global electric eye sensor market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A preliminary “electric eye” sensor was developed by Georgia State University researchers. It has a cutting-edge vertical stacking design that enables micro-scale scaling as well as deeper colour recognition.
The development of a micro-scale camera for microrobots is their ultimate goal, and this work is the first step in that direction. They provide examples of the basic idea and viability of building this novel kind of image sensor, with a focus on downsizing.
Their team’s use of nanotechnology allowed them to create the foundation for the biomimetic artificial vision gadget, which mimics biochemical processes through artificial means. In research, business, medicine, and people’s daily lives, vision is recognised to capture more than 80% of the information.
This biomimetic “electronic eye” increases colour recognition, the most important visual function that is overlooked in present research since it is challenging to downscale the existing colour sensing technology.
Traditional colour sensors frequently use a lateral colour sensing channel structure, take up a lot of physical space, and provide less precise colour identification. They may arrange these novel semiconductor materials in any configuration due to their extreme thinness, mechanical adaptability, and chemical stability.
The current planar micro-electronics layout is being replaced with a three-dimensional integration technique. Their device architecture is able to speed up the downscaling of cameras mostly due to the higher integration density.
