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Last Updated: Apr 25, 2025 | Study Period:
An electronics heat leak infrared (IR) sensor is an electronic device that measures and detects infrared radiation in its surrounding environment. Infrared radiation was accidentally discovered by an astronomer named William Herchel.
While measuring the temperature of each color of light (separated by a prism), he noticed that the temperature just beyond the red light was highest.
IR is invisible to the human eye, as its wavelength is longer than that of visible light (though it is still on the same electromagnetic spectrum). Anything that emits heat (everything that has a temperatureabove around five degrees Kelvin) gives off infrared radiation.
There are two types of infrared sensors: active and passive. Active infrared sensors both emit and detect infrared radiation. Active IR sensors have two parts: a light emitting diode (LED) and a receiver.
When an object comes close to the sensor, the infrared light from the LED reflects off of the object and is detected by the receiver. Active IR sensors act asproximity sensors, and they are commonly used in obstacle detection systems (such as in robots).
The Global electronics heat leak IR sensor market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
TI Launches New IR Temperature Sensor -Texas Instruments Inc. (TI)is enabling contactless temperature measurement for the first time in portable consumer electronics with the industry's first single-chip passive infrared (IR) MEMS temperature sensor.
The TMP006 digital temperature sensor provides manufacturers of mobile devices, such as smartphones, tablets, and notebooks, with the ability to accurately measure device case temperature using IR technology.
This advancement over the current approach of approximating case temperature, based on system temperature, will enable system designers to optimize performance while providing a more comfortable user experience.The TMP006 can also be used to measure temperature outside the device, enabling new features and user applications.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2024 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2024 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |