Global Epoxy Die Bonding System Market 2024-2030
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Global Epoxy Die Bonding System Market 2024-2030

Last Updated:  Apr 25, 2025 | Study Period: 2024-2030

EPOXY DIE BONDING SYSTEM MARKET

 

INTRODUCTION

Epoxy Gluing/Fixing - There are two main types of this: conductive and non-conductive. Conductive epoxy mounts can be used for a variety of purposes, but typically deposit a layer of epoxy under the chip to create a thermal and electrical connection between the chip and substrate.

 

Epoxies are organic compounds composed of carbon chains bonded with other elements such as hydrogen, oxygen, and nitrogen. This connection occurs through covalent bonding, where the elements share a pair of electrons to stay together.

 

The chip is placed in pre-applied epoxy or solder (eutectic). In eutectic die bonding, the process includes heat and gas management to control solder reflow conditions.

 

Die bonding typically requires a high precision of 1-3 μm, much higher than other packaging processes. Epoxy die bonding, also known as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

 

In a typical integrated circuit (IC), circuit layers are built on a base. Most devices connect to the substrate at the module level by connecting metal wires from the top of the IC (wire bond pads) to the surface of the substrate.

 

Therefore, the backside of the chip can be used to attach the IC to the substrate using adhesive. The most common die-bonding material is epoxy. Once the chip is attached to the substrate in this manner, the assembly is typically cured and crosslinked based on the material's specific thermal profile. 

 

EPOXY DIE BONDING SYSTEM MARKET SIZE AND FORECAST

 

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The Global Epoxy Die Bonding System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

EPOXY DIE BONDING SYSTEM MARKETNEW PRODUCT LAUNCH

MRSI Systems (Mycronic Group) of North Billerica, Massachusetts, USA, which manufactures fully automated, high speed, high precision eutectic and epoxy die bonding systems, has released the MRSI-H-HPLD+ .

 

As the latest development of the product line MRSI-H/HVM series. A new variant of the MRSI-H-HPLD, customized for high-performance laser die attach applications, is expected to significantly improve throughput through the use of parallel processing while maintaining high accuracy and flexibility.

 

EPOXY DIE BONDING SYSTEM MARKETCOMPANY PROFILES

 

THIS EPOXY DIE BONDING SYSTEM MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. How many Epoxy Die Bonding Systems are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global Epoxy Die Bonding System and key vendor selection criteria
  3. Where is the Epoxy Die Bonding System manufactured? What is the average margin per unit?
  4. Market share of Global Epoxy Die Bonding System market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global Epoxy Die Bonding System in-house
  6. key predictions for next 5 years in Global Epoxy Die Bonding System market
  7. Average B-2-B Epoxy Die Bonding System market price in all segments
  8. Latest trends in Epoxy Die Bonding System market, by every market segment
  9. The market size (both volume and value) of the Epoxy Die Bonding System market in 2024-2030 and every year in between?
  10. Production breakup of Epoxy Die Bonding System market, by suppliers and their OEM relationship

 

Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
19Market Segmentation, Dynamics and Forecast by Application, 2024-2030
20Market Segmentation, Dynamics and Forecast by End use, 2024-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix