- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Epoxy Gluing/Fixing - There are two main types of this: conductive and non-conductive. Conductive epoxy mounts can be used for a variety of purposes, but typically deposit a layer of epoxy under the chip to create a thermal and electrical connection between the chip and substrate.
Epoxies are organic compounds composed of carbon chains bonded with other elements such as hydrogen, oxygen, and nitrogen. This connection occurs through covalent bonding, where the elements share a pair of electrons to stay together.
The chip is placed in pre-applied epoxy or solder (eutectic). In eutectic die bonding, the process includes heat and gas management to control solder reflow conditions.
Die bonding typically requires a high precision of 1-3 μm, much higher than other packaging processes. Epoxy die bonding, also known as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.
In a typical integrated circuit (IC), circuit layers are built on a base. Most devices connect to the substrate at the module level by connecting metal wires from the top of the IC (wire bond pads) to the surface of the substrate.
Therefore, the backside of the chip can be used to attach the IC to the substrate using adhesive. The most common die-bonding material is epoxy. Once the chip is attached to the substrate in this manner, the assembly is typically cured and crosslinked based on the material's specific thermal profile.
The Global Epoxy Die Bonding System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
MRSI Systems (Mycronic Group) of North Billerica, Massachusetts, USA, which manufactures fully automated, high speed, high precision eutectic and epoxy die bonding systems, has released the MRSI-H-HPLD+ .
As the latest development of the product line MRSI-H/HVM series. A new variant of the MRSI-H-HPLD, customized for high-performance laser die attach applications, is expected to significantly improve throughput through the use of parallel processing while maintaining high accuracy and flexibility.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
© 2017-2025 Mobility Foresights Pvt Ltd. All rights reserved.