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Lithography is the technique of transferring a design from a photomask to the surface of a wafer. During the lithography process, the wafer is subjected to an ultraviolet laser beam, which passes through a photomask layer with no pattern and is irradiated onto photoresist on a wafer.
The many types of lithography processes are photolithography, electron beam, X-ray, extreme ultraviolet, ion projection, and immersion lithography.
Photolithography is important in the current semiconductor industry and is being utilised in a variety of industrial verticals throughout the world. It determines the line dimensions of a semiconductor wafer prior to etching, therefore controlling pattern resolution.
Coating photoresist, soft bake, exposure, post bake, development, and hard bake are all steps in the process of a photolithography system to make a wafer.
The Europe Photolithography Equipment Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
ASML, one of Europe’s hottest stocks, is developing a new version of its extreme ultraviolet lithography equipment, which is used to carve patterns into silicon components that build the world’s most sophisticated processors.
ASML, based in Veldhoven, a tiny hamlet near the Dutch city of Eindhoven, is the only company in the world capable of producing these very complicated EUV machines – but it isn’t stopping there.
The company’s current EUV machine is utilised by TSMC, Samsung, and Intel to produce chips for the newest generation of PCs and smartphones. However, a new version of the EUV machine, codenamed High NA, is in the works, which might allow chipmakers to create even more complex circuits to power.