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Last Updated: Apr 26, 2025 | Study Period: 2022-2027
The study and implementation of photonic systems that use silicon as an optical medium is known as silicon photonics.
Silicon is typically shaped into microphotonic components with sub-micrometer precision. These work in the infrared, most typically at the 1.55 micrometre wavelength that most fibre optic telecommunication systems employ.
The Europe Silicon Photonics Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
The L3MATRIX research and development initiative produced groundbreaking technological advancements in the disciplines of silicon photonics (SiPh) and 3D device integration. Co-packaging the optical interconnects with the switching ASIC, hence expanding the chip radix, demonstrates the potential for network scaling to the Pb/s range.
L3MATRIX introduced a novel approach of designing Data Center switching elements that coupled a high radix connection architecture with a 25 Gb/s extended bandwidth in single mode fibres and low latency waveguides.
Imec, a world-leading research and innovation centre in nanoelectronics and digital technologies, is presenting major milestone results in silicon photonics (SiPho) technology development alongside IDLab and the Photonics Research Group.
The shown building components open the way for 400Gb/s and beyond optical lines, as well as co-packaged optics in next-generation data center switches, both of which are critical enablers for data transmission in future data centres.
A TSV-assisted high-density (Tbps/mm2) CMOS-SiPho transceiver prototype, a low-power 106Gb/s PAM-4 SiPho transmitter, a high-speed Ge/Si avalanche photodetector, and ultra-broadband low-loss single-mode fibre coupler prototype are among the highlights.
The Intel Research Center for Integrated Photonics for Data Center Interconnects was recently opened by Intel Labs.
The objective of the centre is to accelerate optical input/output (I/O) technological innovation in performance scaling and integration, with an emphasis on photonics technology and devices, CMOS circuits and link design, package integration, and fibre coupling.
The UCSB team will look at the challenges of merging InAs quantum dot lasers with traditional silicon photonics.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2027 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2027 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2027 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2027 |
| 21 | Product installation rate by OEM, 2022 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2022 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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