Global EUSB 3.1 Module Market 2023-2030

    In Stock

    GLOBAL eUSB 3.1 MODULE MARKET

     

    INTRODUCTION

    USB 3.1 is the most recent version of the USB (Universal Serial Bus) standard for connecting computers and electrical devices. It has data transmission speeds of up to 10Gbps and, while it can utilise the USB-C connector type, it can also use a range of other connector types.

     

    The only difference between USB 3.1 Gen 1 and USB 3.1 Gen 2 is in terms of speed. USB 3.1 Gen 1 supports speeds of up to 5 Gbit/s, whereas USB 3.1 Gen 2 supports speeds of up to 10Gbit/s. 

     

    GLOBAL eUSB 3.1 MODULE MARKET SIZE AND FORECAST

     

    infographic : EUSB 3.1 Module Market , EUSB 3.1 Module Market Size, EUSB 3.1 Module Market Trend, EUSB 3.1 Module Market Forecast, EUSB 3.1 Module Market Risks, EUSB 3.1 Module Market Report, EUSB 3.1 Module Market Share

     

    The Global eUSB 3.1 Module market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

     

    RECENT DEVELOPMENT 

    IoT applications are targeted by a dependable eUSB 3.1 device. Micron’s new eU500 embedded Universal Serial Bus (eUSB) device has been combined with Hyperstone’s U9 – USB 3.1 flash memory controller and flash management technology.

     

    Both companies collaborated to bring to market a robust flash storage solution that is specifically tailored to meet the highest quality, endurance, and reliability requirements.

     

    The U9, in conjunction with Hyperstone’s hyMap Flash Translation Layer (FTL) and Reliability firmware feature-set, provides better durability and data retention management, as well as rigorous power fail-safe capabilities. Its read disturb management and dynamic data refresh functions optimise data retention and refresh data that is subject to read disturbance.

     

    The U9 expands on Micron’s flash technology to enable eUSB in high-volume applications.The eU500 is USB 3.1 Gen 1 compliant, including SuperSpeed, Hi-Speed, and Full-Speed modes, offering what the firm claims is significantly greater performance over USB 2.0 solutions while keeping backward compatibility.

     

    This eUSB device delivers exceptional performance across different usage patterns, with a sequential read/write speed of up to 170/120 MB/s and a steady state 4K random read/write performance of 3,000/1,000 IOPS.

     

    Its fast random access makes it suitable for rapid boot-up and data logging.Because of its tiny dimensions (36.90×26.6×6.6mm) and low power consumption (less than 300mW while actively reading or writing data), the U9 controller can be employed in space and power-constrained settings.

     

    The eU500 from Micron is designed for next-generation Internet of Things (IoT), boot drives, and data logging applications such as networking, embedded computing, and server. 

     

    COMPANY PROFILE

     

    THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

    1. How many eUSB 3.1 Modules are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global eUSB 3.1 Module and key vendor selection criteria
    3. Where is the eUSB 3.1 Module manufactured? What is the average margin per unit?
    4. Market share of Global eUSB 3.1 Module market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global eUSB 3.1 Module in-house
    6. key predictions for next 5 years in Global eUSB 3.1 Module market
    7. Average B-2-B eUSB 3.1 Module market price in all segments
    8. Latest trends in eUSB 3.1 Module market, by every market segment
    9. The market size (both volume and value) of the eUSB 3.1 Module market in 2023-2030 and every year in between?
    10. Production breakup of eUSB 3.1 Module market, by suppliers and their OEM relationship

     

    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2022-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2022-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2022-2030
    21 Product installation rate by OEM, 2022
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2022
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
     
    0
      0
      Your Cart
      Your cart is emptyReturn to Shop