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Thermosetting adhesives, such as phenolic, melamine, and formaldehyde resins, create solid connections and perform well in hot environments. Because they are thermoset materials, they need heat or heat and pressure to cure and create a solid connection. Phenolic compounds are not too expensive.
The phenol group of compounds is used to create these incredibly resilient resins. Phenolic resins are typically offered in liquid, powder, and film shape. It is the strongest electric field that a material can endure without degrading, and it is particularly significant when a resin is used with an electrical device.
The Global EV Melamine phenolic market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The use of phenol urea/melamine formaldehyde copolymers, as well as a technique for producing them, are all covered by the innovation. The copolymers or polycondensation resins described in the patent are most frequently employed in the manufacture of wooden materials or in the subsequent processing of wood or wooden materials.
As a result, urea and phenol react with formaldehyde separately in the first stage. Only methylol ureas or methyl phenols are produced when the reaction is controlled for duration, pH, and temperature. The next stage involves combining the two reaction mixtures and bringing them into contact with the immobilised ion exchanger. (which can also be used catalytically).
A method of making a copolymer by condensing an aqueous mixture that includes phenol and/or one or more phenol derivatives (P), urea and/or one or more urea derivatives (U), melamine and/or one or more melamine derivatives (M), and formaldehyde in the presence of an anionic and a cationic ion exchanger.
An aqueous precondensate of phenol and/or phenol compounds, also referred to below as PF precondensate, can be condensed with an aqueous precondensate of urea to produce the copolymer according to the invention.
