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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A power module that employs silicon carbide semiconductors as switches is known as a silicon carbide power module. Electrical power, which is the result of current and voltage, is transformed with high conversion efficiency using a silicon carbide power module.
SiC MOSFETs can switch at maximum speed thanks to a low module commutation inductance. Smaller magnetic filter components can be produced by converting the greater switching speeds into higher switching frequencies.
The switching losses can be decreased at the same time, improving system effectiveness. Higher power densities are made possible by sophisticated materials and packaging techniques that reduce the thermal resistance of the chip to the heatsink.
SiC (silicon carbide), a novel material for power semiconductors, outperforms conventional Si (silicon) power semiconductors (IGBT) in high-speed switching performance and outperforms those used in high-temperature situations.
Global EV silicon carbide power module market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
New silicon-carbide (SiC) high-power modules were introduced by STMicroelectronics with the goal of enhancing the efficiency and range of electric vehicles.
Hyundai has decided to deploy the five new SiC-MOSFET based power modules in the E-GMP electric vehicle platform that is shared by the KIA EV6 and numerous other cars.The new modules are primarily made for automakers creating traction applications for electric vehicles.
The ST ACEPACK DRIVE package includes the modules, which are perfect for integrating into EV drives. Third-generation (Gen3) STPOWER SiC MOSFETs from ST, which combine (RDS(ON) x die area) with low switching energy and synchronous rectification, serve as the solution's primary power semiconductors.
When creating upcoming generations of EVs, leading vehicle OEMs are using ST silicon carbide technology to set the pace of electrification.
Traction inverters can go farther thanks to ST's SiC-MOSFET based power modules. By utilising ST's ongoing technological investment to position itself as the leading semiconductor actor in the electrification revolution, our two firms' collaboration has achieved a critical step towards more environmentally friendly electric vehicles.
Faster charging, improved vehicle dynamics, and more energy efficiency are all made possible by ST's STPOWER SiC devices, which are created as compact SiC devices that can tolerate greater operating voltages.
The modules use the thermally efficient and mechanically robust active metal brazed (AMB) substrate technology, installing a separate NTC for each substrate.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |