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To fill up the tiny spaces between hot components and a chassis or heat sink assembly, thermal gap fillers are created in laboratories and inserted into electronic devices and systems. Due to the low thermal conductivity of air, these spaces act as thermal barriers to heat transport.
The small air spaces between components and casings are filled using thermal gap fillers. They fill the area so that a heat-generating component can have the best possible heat resistance. This enables the component and device as a whole to perform at their highest potential.
Air gaps between PC board components and heat sinks, metal enclosures, and chassis, among other things, can be filled with gap fillers. They are perfect for uses where there are gap tolerances because of stepped or uneven surfaces.
Thermal interface materials (TIMs) known as gap fillers transfer heat away from delicate components in electronic assemblies. They typically consist of a ceramic filler and silicone rubber. Gap fillers, like other TIM kinds, are intended to fill the minute air spaces between a heat source and a heat sink.
The global EV Thermal gap fillers market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Henkel releases a new gap filler for electric vehicles that is free of silicone. Henkel will provide new technologies that permit the lifetime protection of battery systems and cost-effective large-scale assembly.
Henkel is utilising its extensive technical base and many years of knowledge and experience to accelerate the switch from traditional engines to electrified powertrains as the major automotive OEMs and new companies are launching new electric vehicle (EV) models at a rapid pace.
Visit the knowledgeable team at booth 1025 to benefit from the expertise of Henkel. Henkel has identified three key issues facing battery manufacturers: dependable heat management for operating safety and achieving the UL94 flammability standard; cost-effective techniques and technologies permitting high-speed cell assembly; and allowing serviceability of battery packs.
Utilizing a wide range of technology and in-depth knowledge specifically suited to overcoming these new problems.
Henkel offers a wide range of thermal management (TIM) products, including silicone-free Bergquist Gap Fillers, to enable the safe and effective thermal management of the battery cells and modules.
Henkel will introduce a series of silicone-free, automation-friendly liquid gap fillers during the exhibition, with the first model featuring a 3.0 W/m-K thermal conductivity.
Henkel also provides thermal adhesive products with structural shear strengths of >10 MPa, which enable differing coefficients of thermal expansion to be overcome by high elongation, as well as Gap Pad and Sil Pad materials for batteries.
