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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
High speed LSI circuits with additional functionality are possible with FC-BGA (flip chip ball grid array) on a semiconductor package substrate with high density. A BGA substrate is essentially a carrier used with various BGA package variants.
Many distinct connector pins are required by a BGA substrate for complex devices like microprocessors, and the process for designing all of these pins and incorporating them into the package can actually be rather challenging. Substrates for FC-BGA semiconductors have strict design guidelines and great dependability.
Through the use of cutting-edge design principles and cutting-edge processing technology, Kyocera offers IC packages that have more than 3,000 I/Os and are compliant with next-generation flip-chip LSI.
| S No | Company Name | Development |
|---|---|---|
| 1 | Samsung | Apple M2 silicon is being invented by Samsung as a high-value FC-BGA substrate. The printed circuit board known as the FC-BGA is what links the chip to the main substrate. Samsung's Electro-Mechanics division created the FC-BGA and also provided FC-BGAs for the M1 series. Only a select few companies, like Taiwan's Unimicron and Japan's Ibiden, have the capacity to supply Apple with FC-BGA on a consistent basis. |
| 2 | Toppan | New FC-BGA Substrates Production Line Launched by Toppan Printing. Due to continued developments in semiconductor technology, there is a growing demand for these thinner substrates. The new line will enable a 2.5x increase in FC-BGA substrate production capacity. |
| 3 | Showa Denko | "MCL-E-795G," an Ultra-Low CTE Core Material for Next-Generation FC-BGA Package Substrate, was introduced by Showa Denko Materials for mass production. High packaging dependability, including reduced warpage and high heat resistance, are attained by MCL-E-795G, which is utilised to manufacture semiconductor package substrates for large servers used in data centres and high-performance computing (HPC). |
| 4. | Daeduck Electronics | Semiconductors called FC-BGA substrates link the semiconductor chip to the primary substrate. As a potential source of future growth for the business, FC-BGAs are being promoted by Daeduck Electronics. A board called FC-BGAs, created by Daeduck Electronics, is applied to 2.5D by integrating a number of input/output (I/O) terminals. |
FC-BGA is an extremely sophisticated technology. To establish itself as a dominant player in the FC-BGA market, Samsung Electro-Mechanics has made significant investments. It appears that Apple started working on the M2 SoC as soon as it started selling Macs with the M1 platform. The business chose to stick with the same FC-BGA supplier for the M2 because Samsung's efforts with the M1 impressed them.
As Toppan LSI devices get smaller and more complicated, chipmakers' demands for speed, power efficiency, and the use of high-density interconnects (which allow for greater functionality in a smaller space) rise. Compared to traditional wire-bonded substrates, FC-BGA substrates are often thinner, which increases device size and weight while also enabling better data transmission.
By using Showa Denko resins that are extremely resistant to thermal shock and external stress as the framework and designing them into the MCL-E-795G series, clients can increase process yields in their manufacturing processes. This series also has great insulation reliability and high heat resistance.
The series has flame-retardant resins as well, giving customers safer semiconductor package substrates, and it has earned V-0/VTM-0 certification under UL-94*7, a standard that specifies the flammability ratings for plastic materials.
Daeduck Electronics A flat arrangement of several different semiconductor chips on a substrate allows 2.5D technology to boost transmission speed while decreasing area. Large substrates with 20 or more layers and a width of at least 100mm can now be produced by Daeduck Electronics.
The market has promising futures. Based on artificial intelligence (AI) technologies, the non-memory semiconductor business has recently expanded quickly in areas including autonomous driving,servers, and data centres.
The Global FC-BGA Substrate market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
FC-BGA became the No. 1 Company in the World thanks to LG Innotek. released a new FC-BGA substrate In order to target the Flip-Chip Ball Grid Array (hereafter referred to as FC-BGA) substrate market, LG Innotek (CEO Jeong Cheol-dong) is stepping up business efforts.
At the recent CES, LG Innotek first unveiled the newest FC-BGA. The FC-BGA from LG Innotek is a highly integrated, multi-layered, and large-scale device.
Moreover, it has numerous micro vias and exquisite patterning. Through a hole, circuits and chips are connected. As a result of pressure and heat during the production process, a condition known as "warpage" is minimised by LG Innotek's FC-BGA.
It was created using Digital Transformation (DX) technology, which attracted a lot of attention from businesses.
LG Innotek is continuing its efforts by quickening the construction of the new plant and gaining more clients soon. At the newest Gumi facility (Gumi No. 4 factory), where FC-BGA would mostly be produced, LG Innotek conducted a celebration (commemorative event for bringing in new facilities) in January.
In the Gumi No.4 facility, which was acquired and has a total gross area of about 220,000 m2, LG Innotek has been building the most recent FC-BGA production lines.
This exceptional facility for FC-BGA will be built as a smart factory that integrates the most recent DX technologies, such as AI, robotization, unmanned system, and intellectualization, among others.
It is anticipated that starting a large-scale production at the new location will hasten the aim for the global FC-BGA market, for network/modem and digital TV. Moreover, it may be possible to develop products for PC/server.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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